Kabushiki Kaisha Toshiba

Ebara Corporation

Other

Hiromi Yajima

Riichirou Aoki

Manabu Tsujimura

Atsushi Shigeta

Shoichi Kodama

Tetsuji Togawa

Riichiro Aoki

Seiji Ishikawa

Toyomi Nishi

Katsuya Okumura

Masako Kodera

Yukio Imoto

Shiro Mishima

Gisuke Kouno

Kazuaki Himukai

Hiroyuki Yano

Haruo Okano

Harumitsu Saito

Masako Watase

Kunihiko Sakurai

Noriaki Yoshikawa

Toshiro Maekawa

Satomi Hamada

Tadashi Yotsumoto

Takashi Omichi

Tatsumi Suganuma

Kenji Nakata

Norio Kimura

Kenya Ito

Tamami Takahashi

Seiji Katsuoka

Kuniaki Yamaguchi

Hideo Aizawa

Nobuyuki Takada

Masayoshi Hirose

Yoshikuni Tateyama

Takanobu Nishimura

Takeshi Sakurai

Kenichi Shigeta

Shirou Mishima

A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.

Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device

A semiconductor manufacturing apparatus having a plurality of portions according to this invention includes a storage device which stores, for each portion, information representing the lapsed time of use or the product processing count till occurrence of a failure after installation of the portion, and a calculation device which receives the information stored in the storage device and outputs function information representing a failure probability and/or failure rate as a function of the lapsed time of use or the product processing count for each portion.

Semiconductor manufacturing apparatus, management apparatus therefor, component management apparatus therefor, and semiconductor wafer storage vessel transport apparatus

A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.

Polishing apparatus

Polishing apparatus and a method of polishing and cleaning and drying a wafer

An apparatus for conveying a workpiece as used to convey the workpiece such as a semiconductor wafer, a glass substrate or liquid crystal panel, between processing apparatuses when the workpiece is processed in the plurality of processing apparatuses. The amount of liquid on a surface of a workpiece is adjusted to a predetermined amount, and the workpiece, which retains the predetermined amount of liquid, is conveyed between processes. The adjusting includes both supplying a sufficient amount of liquid onto the surface of the workpiece, which is in a certain state, and removing a certain amount of liquid from the surface of the workpiece.

Apparatus for conveying a workpiece

Polishing apparatus and method

A polishing apparatus can produce a uniform quality of polished products by supplying a polishing solution consistently without being affected by any disturbances in the solution supply source. The polishing apparatus comprises: a polishing section for polishing a workpiece by pressing the same against a polishing tool; a solution piping assembly to be connected to an external solution supply device for transferring a polishing solution therefrom to the polishing section; and a solution suction device provided in the solution piping assembly for introducing the polishing solution from the solution supply device to the polishing section at a desired flow rate.

A polishing apparatus includes a top ring for holding a workpiece to be polished on a lower surface thereof, a turntable having a polishing surface for polishing a surface of the workpiece held by the top ring, and a dressing tool for dressing the polishing surface of the turntable. The top ring is movable to a first maintenance position therefor, and the dressing tool is movable to a second maintenance position therefor. The top ring, the turntable, and the dressing tool are housed in a single chamber having a plurality of side faces. The polishing surface, the first maintenance position, and the second maintenance position are positioned closely to one of the side faces of the chamber. Such one side face serves as a maintenance face for approaching the polishing surface, the first maintenance position, and the second maintenance position for maintenance of the polishing surface, the top ring and the dressing tool.

Growing community of inventors

Yokohama, Japan

Hiromi Yajima