Fujifilm Corporation

Hiromi Kanda

Shinichi Kanna

Toshiaki Fukuhara

Fumiyuki Nishiyama

Kunihiko Kodama

Kazuyoshi Mizutani

Yushi Kaneko

Kenji Wada

Daisuke Sasaki

Haruki Inabe

Kei Yamamoto

Kazuhiro Fujimaki

Wataru Kikuchi

Shigekazu Suzuki

Shinichi Nakahira

Yohei Ishiji

Kazumasa Morozumi

Koichi Sugihara

Schinichi Kanna

Soji Ishizaka

Tomoyoshi Hyodo

A resin is to be added to a resist composition and localized on a surface of a resist film so as to hydrophobilize the surface of a resist film and has a peak area of a high molecular weight component having a molecular weight of 30,000 or more is 0.1% or less of a total peak area in a molecular weight distribution measured by gel permeation chromatography.

Resin for hydrophobilizing resist surface, method for production thereof, and positive resist composition containing the resin

A positive resist composition comprises: (A) a resin of which solubility in an alkali developer increases under an action of an acid; (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (C) a resin having at least one of a fluorine atom and a silicon atom; and (D) a solvent; and a pattern forming method using the positive resist composition.

Positive resist composition, resin used for the positive resist composition, compound used for synthesis of the resin and pattern forming method using the positive resist composition

A positive resist composition comprising: (A) a resin which comes to have an enhanced solubility in an alkaline developing solution by an action of an acid; (B) a compound which generates an acid upon irradiation with actinic rays or a radiation; (C) a fluorine-containing compound containing at least one group selected from the groups (x) to (z); and (F) a solvent, and a method of pattern formation with the composition: (x) an alkali-soluble group; (y) a group which decomposes by an action of an alkaline developing solution to enhance a solubility in an alkaline developing solution; and (z) a group which decomposes by an action of an acid.

Positive resist composition and method of pattern formation with the same

There is provided a pigment dispersion composition having high pigment dispersibility and dispersion stability and favorable color characteristics even when containing a high concentration of pigment; a photocurable composition superior in developability and pixel surface smoothness, allowing high contrast; and a color filter having high contrast. A pigment dispersion composition containing a polymeric compound having a specific group or the like dissociated by an alkali is used.

Pigment dispersion composition, photocurable composition and color filter

A positive resist composition for immersion exposure comprises: (A) a resin containing at least one repeating unit having a fluorine atom and increasing a solubility of the resin in an alkali developer by an action of an acid; and (B) a compound capable of generating an acid upon irradiation with one of an actinic ray and radiation.

Positive resist composition for immersion exposure and pattern-forming method using the same

A positive resist composition comprises: (A) a resin that has a repeating unit represented by general formula (a1) and increases its solubility in an alkali developer by action of an acid; (B) a compound which generates an acid upon irradiation with an actinic ray or a radiation; and (C) a resin that has at least one of a fluorine atom and a silicon atom and has a group selected from the group consisting of (x), (y) and (z); and (D) a solvent: wherein R represents a hydrogen atom or a methyl group, Rxa represents an alkyl group or a cycloalkyl group, and n represents an integer of 1 to 8.

Positive resist composition and pattern-forming method

A positive resist composition for immersion exposure comprises: (A) a resin capable of increasing its solubility in an alkali developer by an action of an acid, and (B) a compound capable of generating an acid upon irradiation with actinic ray or radiation, wherein the acid satisfies conditions of V&#x2267;230 and V/S&#x2266;0.93 taking van der Waals volume of the acid as V (&#x212b;), and van der Waals surface area of the acid as S (&#x212b;).

A positive resist composition, which comprises a resin having a structure showing a basicity and capable of increasing the solubility in an alkali developer by the action of an acid, and a pattern-forming method using the same.

Positive resist composition and pattern-forming method using the same

A positive resist composition, which comprises: (A) a resin of which solubility in an alkali developer increases under an action of an acid; (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (C) a resin having at least one of a fluorine atom and a silicon atom; and (D) a solvent, wherein the resin (C) contains at least one of: (C1) a resin having at least one of a fluorine atom and a silicon atom and having an alicyclic structure; and (C2) a resin containing a repeating unit having at least one of a fluorine atom and a silicon atom in a side chain and a repeating unit having an unsubstituted alkyl group in a side chain; and a pattern forming method.

Positive resist composition and pattern forming method using the same

A photosensitive composition containing a compound having a specific structure as described in the specification, a pattern-forming method using the photosensitive composition and the compound having a specific structure used in the photosensitive composition.

Photosensitive composition, pattern-forming method using the photosensitve composition and compound in the photosensitive composition

A positive type resist composition for use in liquid immersion exposure comprises: (A) a resin having a monocyclic or polycyclic cycloaliphatic hydrocarbon structure, the resin increasing its solubility in an alkali developer by an action of acid; (B) a compound generating acid upon irradiation with one of an actinic ray and a radiation; (C) an alkali soluble compound having an alkyl group of 5 or more carbon atoms; and (D) a solvent.

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Shizuoka, Japan

Hiromi Kanda