Tokyo Electron Limited

V-tex Corporation

Hiroki Oka

Keisuke Kondoh

Tsuyoshi Moriya

Hiroyuki Nakayama

Hiroshi Narushima

Hiroshi Ohno

Jun Hirose

Takehiro Shindo

Hiroshi Koizumi

Yoji Iizuka

Norihiko Tsuji

Atsushi Kawabe

Tatsuya Nakagome

Makoto Tashiro

Nobuaki Ito

Sho Otsuki

Kenichi Nakagawa

A substrate processing device includes a transfer chamber configured to transfer a substrate under an atmospheric atmosphere and a plurality of processing units each including at least one processing chamber for processing the substrate under a vacuum atmosphere and at least one load-lock chamber connected to the processing chamber to switch an inner atmosphere thereof between the atmospheric atmosphere and the vacuum atmosphere. The transfer chamber includes a connection unit configured to connect the transfer chamber and the load-lock chamber such that each of the processing units is detachably attached. The connection unit includes an opening that allows the transfer chamber to communicate with the load-lock chamber, and an opening/closing mechanism configured to open and close the opening portion.

Substrate processing device

A substrate processing apparatus includes a transfer device, having a first pick configured to hold the substrate, configured to transfer a substrate; a detecting device configured to detect a position of the substrate; a susceptor configured to place the substrate thereon; an elevating device configured to move the substrate up and down; and a control device. The control device comprises an adjuster configured to perform a teaching processing; a detector configured to deliver the substrate from the first pick to the susceptor and from the susceptor to the first pick, and configured to detect a first position of the substrate, which is delivered from the susceptor to the first pick, by the detecting device; and a corrector configured to correct the position of the first pick based on a deviation amount between the first position of the substrate and a reference position.

Substrate processing apparatus and transfer position correcting method

The purpose of the present invention is to accurately deal with a variety of processing conditions and variations thereof, and to improve total throughput by efficiently operating a conveyance arm device in accordance with the processing conditions, even during cleaning. When a first wafer is loaded on a load-lock chamber, a conveyance-sequence category for operating each of a number of steps for a conveyance arm device capable of operating during cleaning is selected in accordance with processing conditions of the wafer, and a plurality of operation patterns are selected, combined and scheduled. The conveyance arm device is controlled in accordance with the scheduled conveyance sequence to control substrate conveyance.

Substrate conveyance method, and substrate conveyance device

A gate valve cleaning method that can clean a gate valve that brings an atmospheric transfer chamber and an internal pressure variable transfer chamber that transfer a substrate into communication with each other or shuts them off from each other without bringing about a decrease in the throughput of a substrate processing system. Before the gate valve brings the atmospheric transfer chamber and the internal pressure variable transfer chamber into communication with each other, the pressure in the internal pressure variable transfer chamber is increased so that the pressure in the internal pressure variable transfer chamber can become higher than the pressure in the atmospheric transfer chamber.

Gate valve cleaning method and substrate processing system

An intermediate transfer chamber that can prevent formation of defects in substrates. The intermediate transfer chamber is provided between a loader module being in a first environment where the interior thereof is at a first pressure and contains moisture, and a chamber of a process module being in a second environment where the interior thereof is at a second pressure lower than the first pressure. The intermediate transfer chamber comprises a transfer arm comprising a pick that bidirectionally transfers a substrate between the loader module and the chamber and supports the substrate, a load-lock module exhaust system that exhausts the interior of the intermediate transfer chamber so as to reduce pressure in the intermediate transfer chamber from the first pressure to the second pressure, and a plate-like member that controls the conductance of exhaust on at least a principal surface of the substrate opposite to the pick when the interior of the intermediate transfer chamber is exhausted.

Intermediate transfer chamber, substrate processing system, and exhaust method for the intermediate transfer chamber

Load-lock chamber

A detecting device includes a sensor support body having a pair of arms, and an optical sensor having a combination of a light emitting unit and a light receiving unit disposed on one and the other of the arms, respectively. A control operation section controls a driving section and, with the arms inserted in a cassette, the sensor support body is moved, thereby performing a scanning operation for scanning the substrate by the optical sensor. The scanning operation is set such that a light beam is related to the substrate while vertically moving at a plurality of scanning positions. The control operation section finds out the presence of absence of the substrate and the position of the front end of the substrate within the cassette on the basis of data obtained from the optical sensor during scanning.

Semiconductor processing-purpose substrate detecting method and device, and substrate transfer system

Transfer-chamber

A vacuum processing device includes a driven bodyprovided inside a vacuum processing chamber, a driving meansprovided outside the vacuum processing chamberand a drive shaftconnecting the driven bodyto the driving means. A first annular bodyis secured to the drive shaftand a second annular bodyis rotatably supported by the first annular body. A bellowsthat airtightly seals the periphery of the drive shaftis provided so as to connect the second annular bodywith the inner wall of the vacuum processing chamber. In this structure, the bellowsis allowed to move as one body with the drive shaftduring vertical motion of the drive shaftbut is made to stay in place during rotational motion of the drive shaft. Thus, the drive shaft, which engages in vertical motion and rotational motion, is airtightly sealed by the bellows.

Vacuum processing device

A gate valve ( ) for a semiconductor processing system includes a base frame ( ) configured movable along a guide ( ) to move toward and away from a valve seat ( ), which surrounds an opening portion ( ). A first stopper ( ) is disposed at the upper end of the guide ( ), for defining the movement limit of the base frame ( ) on the valve seat ( ) side. A swing frame ( ) is rotatably attached to the base frame ( ), and has an upper end connected to a valve plug ( ). The swing frame ( ) is connected to the base frame ( ) by a link mechanism ( ), which can bend and stretch while flexing an intermediate portion, and by a spring and damper member ( ). The intermediate portion of the link mechanism ( ) has a mediation member ( ) connected to a reciprocation rod ( ) of an air actuator ( ).

Gate valve for semiconductor processing system

Provided is a gate valve for opening and closing an aperture formed in a body of a chamber and designed so that an object is loaded into or unloaded from the chamber, comprising a lift mechanism provided on a side portion of the chamber body, a supporting portion supported by a lift mechanism for up-and-down motion, a valve plate supported by the supporting portion and movable between a closed position such as to close the aperture of the chamber body and an open position such that the valve plate is separated from the aperture to leave the aperture open as the supporting portion is moved up and down by the lift mechanism, and a separating mechanism for allowing the valve plate to move to a position ahead of the aperture so that the valve plate is separated from the aperture.

Growing community of inventors

Nirasaki, Japan

Hiroki Oka