Tokyo Electron Limited

Samsung Electronics Co., Ltd.

Hiroki Hosaka

Shuji Akiyama

Tadashi Obikane

Toshihiko Iijima

Takashi Nakao

Hiroshi Amemiya

Fumito Kagami

Shinya Shimizu

Masahiko Akiyama

Ki Sang Kang

Takao Ishii

Techniques for testing both a rectangular substrate and a circular substrate are provided. One aspect of the present disclosure pertains to a test device comprising an exchangeable change kit, wherein the change kit comprises a first holding device and a second holding device which are exchangeably mounted in the test device, wherein the first holding device is configured to adsorb and hold a rectangular substrate, wherein the second holding device is configured to adsorb and hold a circular substrate, and wherein the first holding device and the second holding device are exchanged according to a substrate to be tested.

Test device, change kit, and method of exchanging change kit

A wafer inspection apparatus according to one embodiment is a wafer inspection apparatus including a plurality of inspection parts arranged in a height direction and a lateral direction, and includes a pair of air circulating means disposed at both ends in a longitudinal direction of an air circulating region including the plurality of inspection parts arranged in the lateral direction and configured to circulate air in the circulating region.

Wafer inspection apparatus

An inspection apparatus includes a load port area in which a carrier accommodation chamber for accommodating a carrier that receives an inspection object is disposed; an inspection area in which a plurality of probe cards are respectively disposed under a plurality of inspection devices, and in which the probe card is pressed against an electronic device of the inspection object on a chuck top to inspect the electronic device; a transfer area in which a transfer mechanism transfers the inspection object onto the chuck top; and a plurality of probe card accommodation devices disposed in at least one of the load port area or the inspection area, each probe card accommodation device being capable of accommodating the probe card, and a number of the probe card accommodation devices being equal to or greater than a number of the probe cards.

Inspection apparatus

In a transfer method for transferring a substrate in an inspection system configured to perform a test on electrical characteristics of the substrate, the inspection system including an inspection unit including a plurality of test devices configured to perform the test on the electrical characteristics of a substrate, a loader unit configured to mount a cassette which accommodates a plurality of substrates, and a transfer device configured to transfer a substrate between the inspection unit and the loader unit, an inspected substrate is received by the transfer device from the inspection unit. The inspected substrate received from the inspection unit is transferred toward the loader unit in a state where an opening portion of a transfer arm container of the transfer device. Then, the inspected substrate is delivered to the loader unit.

Transfer method and inspection system

There is provided a probing apparatus capable of modifying an existing probing apparatus having a single loading port to one having dual loading ports while saving the space without increasing a foot print thereof and also capable of increasing an inspection efficiency by cooperating with an automatic transfer line for the apparatus having a single loading port. The probing apparatus includes a prober chamber in which a wafer is inspected and a loader chamber having: a first and a second loading ports positioned to be spaced apart from each other at the side of a prober chamber, each of the loading ports mounting thereon a cassette accommodating therein a plurality of waters; and a wafer transfer unit for transferring the wafers between the loading ports and the prober chamber. The loading ports are arranged along a route where the cassette is transferred by an automatic transfer device.

Probing apparatus and probing method

There is provided a processing apparatus capable of modifying an existing processing apparatus having a single loading port to one having dual loading ports by providing an additional loading port without increasing a foot print thereof and also capable of realizing a complete automation of a wafer transfer by utilizing an existing automatic transfer line. The processing apparatus includes a loader chamber having: a first and a second loading ports positioned to be spaced apart from each other at the side of a prober chamber, each of the loading ports mounting thereon waters; a sub-chuck, disposed under the second loading port, for positioning the wafers; and a wafer transfer unit having a transfer arm for transferring the wafers between the sub-chuck and the prober chamber, the transfer arm being rotatable and movable vertically.

Processing apparatus

Wafer carrying-in/out apparatus

Wafer carrying-in/out machine

In a substrate transfer apparatus, an adaptor unitincludes a box-shaped main bodyhaving three open sides; and a plurality of stage armsdisposed in the main body, serving as substrate mounting members. Each of the stage armshas a disc-shaped wafer supporting portiondisposed at an approximately central portion of the main bodyand a flat bodydisposed in the main bodyso as not to interfere with the moving paths of transfer armsand. Formed at a connecting portion of the wafer supporting portionand the bodyare cutout portionsfor preventing interference between the stage armsand two prongs of leading end portions of the transfer armsandintroduced into the main body

Substrate transfer apparatus and method, and storage medium

The present invention relates to conveyance method for transporting a plurality of unprocessed/processed objects between an automatic transporting device (AGV) and a semiconductor manufacturing device (prober). The prober has a load port to/from which the objects are delivered from/to the AGV. The method comprises the steps of: making a communication between the AGV and the prober to decide respective timings of deliveries of the objects to/from the load port; and transporting the objects between the AGV and the prober via the load port, with the timings of the deliveries of the objects to/from the load port shifted from each other by using a holding site for provisionally holding the object. The holding site is at least one of components of the AGV and the prober other than the load port.

Growing community of inventors

Nirasaki, Japan

Hiroki Hosaka