Tokyo Electron Limited

Tokyo Electron Limi Ted

Hirofumi Haga

Hiroshi Tsujimoto

Takao Funakubo

Shinichi Kozuka

Kumiko Ono

Wataru Ozawa

Nobutaka Nakao

Akihiro Sakamoto

Naoki Taniguchi

Shigeru Senzaki

Hideaki Yakushiji

Akinori Miyata

A controller disclosed herein drives, in a first step, a high frequency generating source at a first energy condition, and drives, in a second step, a high frequency generating source at a second energy condition. Prior to a switching time of the first step and the second step, the controller switches gas species supplied from the gas supply system into the processing container, and sets a gas flow rate in an initial period just after the switching to be larger than a gas flow rate in a stabilization period after lapse of the initial period.

Plasma processing apparatus and plasma processing method

A plasma processing apparatus includes: a processing container; a processing gas supply unit; a mounting table configured to mount a to-be-processed substrate thereon; an upper electrode provided above the mounting table; a plasma generation unit configured to supply a high frequency power to generate plasma of the processing gas; an exhaust flow path formed by a side wall of the processing container and a side surface of the mounting table; a conductive rectification plate configured to adjust a flow of the processing gas discharged to outside of the processing container; a conductor arranged in the exhaust flow path at a position higher than the rectification plate and lower than the to-be-processed substrate to face at least a part of the upper electrode. A distance of the conductor in the height direction in relation to the to-be-processed surface of the substrate is set to be within a predetermined range.

Plasma processing apparatus

An evacuation method used for a vacuum processing apparatus including a vacuum processing chamber is provided. The vacuum processing chamber is evacuated by an exhaust device for a first predetermined period of time by opening a valve connecting the exhaust device with the vacuum processing chamber. A pressure in the vacuum processing chamber is urged to increase by closing the valve and leaving the valve closed for a second predetermined period of time after evacuating the vacuum processing chamber. Evacuating the vacuum processing chamber and urging the pressure in the vacuum processing chamber to increase are performed so as to reduce the pressure in the vacuum processing chamber to a pressure between 6.7 Pa and 13.3&#xd7;10Pa (between 5 Torr and 10 Torr) without freezing moisture in the vacuum processing chamber.

Evacuation method and vacuum processing apparatus

Growing community of inventors

Miyagi, Japan

Hirofumi Haga