Toyota Jidosha Kabushiki Kaisha

Hidemi Senda

Masahiro Sugimoto

Yuji Takeda

Yohei Iwahashi

Kazumi Chida

Masaru Nagao

Masato Hashimoto

Keiko Neki

Norihisa Okayama

A manufacturing method of a semiconductor device is provided with an inspecting of a semiconductor substrate by an inspection method, the method including heating the semiconductor substrate, measuring first and second characteristics. The measuring of a first characteristic is performed by bringing a plurality of probes into contact with the heated semiconductor substrate and making a first electric current flow in the semiconductor substrate. The measuring of a second characteristic is performed, after the measuring of the first characteristic, by bringing a plurality of probes into contact with the heated semiconductor substrate and making a second electric current flow in the semiconductor substrate. A number of the plurality of probes used in the measuring of the second characteristic is larger than a number of the plurality of probes used in the measuring of the first characteristic. The second electric current is larger than the first electric current.

Inspection method for semiconductor substrate, manufacturing method of semiconductor device and inspection device for semiconductor substrate

A sensing device, such as an angular speed detecting device, includes a vibrator for improving detection precision. The vibrator is displaceably supported on a substrate and is vibrated in the direction of an X-axis by driving electrodes. Detecting electrodes detect vibrations of the vibrator in the direction of a Y-axis caused by a Coriolis' force resulting from the angular speed occurring about a Z-axis. Each of the driving and detecting electrodes includes a movable electrode that is connected to the vibrator and that is displaced together therewith on the substrate and a fixed electrode fixed onto the substrate in such a manner as to face the movable electrode. By equalizing conductors connected to fixed electrodes of the driving electrodes and conductors connected to fixed electrodes of the detecting electrodes in length, width, and thickness, respectively, one electrical characteristic is set for those of the wiring portions which function in the same manner.

Sensing device and sensor apparatus

The present invention controls ignition timing appropriately while an increment correction of the fuel injection amount is implemented. A control device of the invention determines a retard angle based on a difference between a prior increment factor, which is determined prior to an actual increment of the fuel injection amount in response to loading of the engine and an OTP fuel increment correction factor for determining the actual increment of the fuel injection amount. The engine load may be determined by intake air quality and rotating speed. When the increment correction is delayed for a fixed time period, the structure of the invention effectively prevents the ignition timing from being retarded excessively due to frequent knocking at the beginning of the delay time. This accordingly prevents the ignition timing from being maintained in the retarding condition to undesirably lower the power of the engine when the delay time has elapsed and an actual increment of the fuel injection amount has been executed. In the ignition timing control of the invention, an increase in retard angle immediately affects the ignition timing control while a decrease in retard angle slowly affects the ignition timing control. This allows the ignition timing to be controlled appropriately without undesirable delay.

Control device for an internal combustion engine

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Toyota, Japan

Hidemi Senda