Tokyo Electron Limited

Hideki Mizuno

Masahiro Ogasawara

Noriyuki Kobayashi

Yoshinobu Hayakawa

Akinori Kitamura

Shin Okamoto

Kazuya Kato

Katsuhiko Ono

Yoshinori Suzuki

Yoshiyuki Kato

Kumiko Yamazaki

Yasushi Inata

A method for processing substrates includes providing a first substrate including a first region and a second region, the first region including a stack of a silicon oxide film and a silicon nitride film, the second region including a single layer of a silicon oxide film; etching the first substrate with a process gas including a sulfur containing gas, in accordance with varied flow rates of the sulfur containing gas, thereby determining each relationship between a given flow rate from among the varied flow rates of the sulfur containing gas and a shape difference between respective recessed portions formed in the first region and the second region; determining a flow rate of the sulfur containing gas on a basis of each relationship; and etching a second substrate at the determined flow rate of the sulfur containing gas.

Method of processing substrates and substrate processing apparatus

An etching method of silicon-containing oxide film is provided. The etching method includes a first step of forming an etching pattern on the silicon-containing oxide film by etching the silicon-containing oxide film using a first plasma generated from a first gas supplied to the processing vessel, according to a pattern of a mask layered on the silicon-containing oxide film, and a second step of removing a reaction product adhering to vicinity of an opening of the etching pattern and to the mask using a second plasma generated from a second gas supplied to the processing vessel, by applying a first high frequency electric power for generating plasma and a second high frequency electric power for generating bias voltage.

Etching method

A plasma etching method includes a first process and a second process. In the first process, a hole is formed in a processing target film formed on a substrate accommodated within a processing chamber by performing an etching process of etching the processing target film. In the second process, a removing process, a deposition process and an extending process are repeatedly performed. In the removing process, a reaction product adhering to an inlet portion of the hole which is formed through the etching process is removed. In the deposition process, a deposit is deposited on a sidewall of the hole from which the reaction product is removed through the removing process. In the extending process, the hole, in which the deposit is deposited on the sidewall thereof through the deposition process, is deeply etched by performing the etching process.

Plasma etching method and plasma etching apparatus

A method of supplying an etching gas includes: supplying a first etching gas used in an etching process into a processing container; and supplying a second etching gas used in the etching process into the processing container, in which, when the first etching gas and the second etching gas are switched therebetween, only a small amount of a gas, which is needed as an etching gas before the switching and is not needed as an etching gas after the switching, is continuously supplied into the processing container.

Method of supplying etching gas and etching apparatus

A plasma etching is performed on a substrate having a pattern wherein an interval between neighboring openings formed on a resist mask is equal to or less than 200 nm, wherein the etching is performed by converting a processing gas comprising an active species generating gas which includes a compound having carbon and fluorine, and a nonreactive gas which includes xenon gas into a plasma. The nonreactive gas further includes argon gas.

Growing community of inventors

Miyagi, Japan

Hideki Mizuno