Kabushiki Kaisha Toshiba

Hideki Kimijima

Takashi Yamaguchi

Tatsuya Ohguro

Takashi Yoshitomi

Masahiro Inohara

Ryoji Hasumi

Kenji Yamada

An integrated circuit device includes a fuse in which a pair of terminal portions connected to different conductive components is provided on both sides of a cuttable portion that is cut as needed by being irradiated with laser light, the cuttable portion and the pair of terminal portions being integrally formed. The cuttable portion may be thinner than the terminal portions.

Integrated circuit device

At present, Cu (copper) is being used as a wiring material. In an RF-CMOS device as a combination of an RF analog device and CMOS logic device, two electrodes of a MIM capacitor are formed from Cu having a large diffusion coefficient. To prevent Cu from diffusing to the capacitor insulating film of the MIM capacitor, diffusion prevention films having a function of preventing diffusion of Cu are interposed between the capacitor insulating film and the two electrodes. As a result, Cu forming the electrodes does not diffuse to the capacitor insulating film.

MIM capacitor having flat diffusion prevention films

Growing community of inventors

Yokohama, Japan

Hideki Kimijima