Hitachi-high-technologies Corporation

Hitachi High-tech Corporation

Hitachi Automotive Systems, Ltd.

Hideki Fukushima

Toshifumi Honda

Yuta Urano

Yukihiro Shibata

Yoshio Morishige

Hiroyuki Yamashita

Mamoru Kobayashi

Eiji Imai

Koichi Nagoya

Yasuhiro Yoshitake

Hiroshi Akiyama

Kenichi Gunji

Tomonari Morioka

Akio Yazaki

Masato Higuma

Masanori Gunji

Nobuaki Hirose

Tsuneyoshi Inoue

Yasuyuki Tanaka

As a technique to improve processing efficiency of defect inspection by quickly adjusting a position of a detection system, provided is a defect inspection apparatus including: a stage that moves with a sample and a pattern substrate placed thereon; an illumination optical system that irradiates an object on the stage from a direction inclined from the normal direction of the pattern substrate; a first detection optical system that detects scattered light in the normal direction; a second detection optical system that detects scattered light in a direction different from the scattered light detected by the first detection optical system; a signal processing unit that processes both scattered light signals; and a control unit. The control unit implements first adjustment processing of adjusting a focal position of the first or the second detection optical system and a three-dimensional position of each detector with respect to an illumination region by using a scattered light signal and second adjustment processing of adjusting a focal point by changing a position in an optical axis direction of a detector of the first or the second detection optical system and a position in a height direction of the stage, and implements the second adjustment processing at a higher frequency than the first adjustment processing.

Defect inspection apparatus and pattern chip

In a defect inspection device that irradiates a surface of a sample or a surface of a pattern chip with an illumination light shaped to extend in a first direction, and detects a scattered light generated from the surface of the sample or the surface of the pattern chip by the illumination light to detect a defect on the surface of the sample, the pattern chip has a dot pattern area in which multiple dots are arrayed in multiple rows and multiple columns, a minimum interval between the dots corresponding to the lines aligned in the first direction among the multiple dots arrayed in the dot pattern area in a second direction orthogonal to the first direction is smaller than a width of the illumination light, and a minimum interval between the multiple dots arrayed in the dot pattern area is larger than a resolution of the detection optical system.

Defect inspection device, pattern chip, and defect inspection method

A defect inspection device inspecting a sample includes a movable table on which the sample as an inspection object and a pattern chip are mounted, an illumination light irradiation unit which irradiates a surface of the sample or a surface of the pattern chip with linearly-formed illumination light, a detection optical system section where a plurality of detection optical systems are disposed at a plurality of positions above the table and which detect images of scattered light generated from the sample, and a signal processing unit which processes detected signals to detect a defect of the sample surface, and a plurality of repeating patterns for generating the scattered light according to positions of the objective lenses of the plurality of detection optical systems of the detection optical system section when the linearly-formed illumination light is irradiated by the illumination light irradiation unit are periodically formed in the pattern chip.

Defect inspection method and device using same

Provided are a contamination inspection method and a contamination inspection device for highly accurately detecting a defect in a wafer, a liquid crystal substrate and media or the like including patterns, for example, a semiconductor device or the like. The first aspect of the present invention is a contamination inspection device comprising: an irradiation optical system for irradiating lights on the inspection target substrate; and a spatial filter for shading diffracted lights form the inspection target substrate. Herein, the spatial filter comprises: a plurality of light shading materials; a control member for changing at least one of parameters selected from a shape, an angle and an interval with respect to the light shading material, and a control unit for controlling the control members.

Contamination inspection method and contamination inspection device

The defect inspecting apparatus is capable of easily performing adjustment with a change of an elevation angle of illumination to a substrate to be inspected, while being low in cost. A plane parallel plate and a cylindrical lens supported by a lens holder are symmetrically disposed at the same tilt angle &#x3b8; with respect to a horizontal plane. A shift in optical axis at a focal position of light () with the rotation of the cylindrical lens can be prevented from occurring. The light can be rotated with a motor and a belt by a rotating mechanism, while allowing the optical axes of the light to match each other at the same focal position. The lens holder and the rotating mechanism are connected to a vertically moving mechanism and moved along a guide of the vertically moving mechanism to thereby adjust the focal position of the cylindrical lens.

Defect inspecting apparatus and defect inspecting method

In a foreign matter inspection apparatus comprising: irradiating unit for irradiating inspection light to an inspection area of an article to be inspected; intensity detecting unit for detecting intensity of either reflected light or scattered light, which is generated from the inspection area by irradiating thereto the inspection light; position detecting unit for detecting a position of either the reflected light or the scattered light within the inspection area; and deciding unit for deciding whether or not a foreign matter is present within the inspection area; the foreign matter inspection apparatus is comprised of: display unit capable of displaying thereon both a threshold image in which the threshold value is indicated over an entire area of the inspection area, and a detection sensitivity image indicated by being converted from the threshold image.

Foreign matter inspection method and foreign matter inspection apparatus

Disclosed herein is a method for processing an orifice capable of processing recessed portions and orifices, each having a unique hole diameter different from each other, to high positioning accuracy and in a short time. A press includes: a B-axis angle indexing devicedisposed on a base, the B-axis angle indexing deviceincluding a table B; an A-axis angle indexing devicedisposed on the table B, the A-axis angle indexing deviceincluding a table A; a chuckdisposed on the table A, the chuckfor holding a work; a base Zdisposed on a base, the base Zbeing operable in an axis Z-direction; a base Xdisposed on the base Z, the base Xbeing operable in an axis X-direction; a punch holding portiondisposed on the base X, the punch holding portionbeing operable vertically in an axis Y-direction; and a plurality of punchesheld on the punch holding portion in parallel with the axis Z. The press is used to perform a pressing cycle at a desired position by changing a posture of the work and moving the punch in the Z-direction continuously using punches having different leading end diameters and shapes with the work held in the chuck.

Method of processing orifice

Growing community of inventors

Tokyo, Japan

Hideki Fukushima