Kabushiki Kaisha Nihon Micronics

Hidehiro Kiyofuji

Tatsuo Inoue

Yuji Miyagi

Kiyotoshi Miura

Osamu Arai

Akihisa Akahira

Yuki Saito

Shinji Kuniyoshi

Yoshiyuki Fukami

Yoshinori Kikuchi

Toshiyuki Kudo

Noboru Otabe

Kenji Sasaki

Hitoshi Sato

Tetsuya Iwabuchi

Naoki Suto

Seiji Kanazawa

Provided is a probe card with which the adjustment of height deviations of needle tip parts of probes and the adjustment of parallelism between the probes and an object to be inspected are simplified. The probe cardhas: a wiring substratehaving wiringtherein or on a surface thereof or the like; a plurality of probes; and a dielectric film. The dielectric filmis disposed to be spaced a distance away from a main surfaceof the wiring substrateat a position spaced away further from the wiring substratethan the needle tip partsof the probes, so that one surfaceof the dielectric filmfaces the needle tip partsand faces the main surfacethat is a probe installation surface of the wiring substrate. The probe cardconfigures a state in which the needle tip partsface an electrode of an object to be inspected with the dielectric filminterposed between the probe cardand the needle tip parts, during an inspection of the object to be inspected. An inspection signal supplied from an inspection device to the probesis set as an alternating current signal, and the probe cardcauses capacitive coupling between the needle tip partsand the electrode of the object to be inspected, and transmits the inspection signal.

Probe card

A probe card having uniform temperature distribution under control to a desired temperature is provided, so as to provide an inspection apparatus and an inspection method. The probe card includes a supporting substrate, a wiring layer arranged including a wiring on a main surface of the supporting substrate, a probe arranged on a surface serving as an opposite side to a side of the supporting substrate of the wiring layer so as to be connected to the wiring, and a plurality of heaters. Further, the probe card is virtually divided into heater regions according to a plurality of heater regions arrayed in vertical and horizontal directions in plan view, and at least one of a plurality of heaters is arranged in each of the plurality of heater regions. An inspection apparatus is configured including the probe card, and an object to be inspected is inspected by use of the inspection apparatus.

Probe card with temperature control function, inspection apparatus using the same, and inspection method

An apparatus includes a wiring base plate arranged on an upper side of a chuck top and having a wiring path connected to a tester, a probe card having a probe board spaced from the wiring base plate with a first surface thereof opposed to the wiring base plate and having a wiring path corresponding to the wiring path and probes provided on a second surface of the probe board to be connected to the wiring path and enabling to respectively contact connection pads of a semiconductor wafer on the chuck top, and an electric connector connecting the wiring base plate to the probe board by low heat conduction supporting members and decreasing heat conduction therebetween and electrically connecting the wiring paths.

Electric connecting apparatus

An apparatus includes a probe card having a probe board with a conductive path electrically connected to a tester and probes enabling to respectively contact connection pads of a semiconductor wafer on a chuck top and moving relatively to the chuck top, and an elastic heat conducting member arranged between a working surface of the chuck top or the semiconductor wafer on the working surface and the probe board. The elastic heat conducting member can abut on the working surface of the chuck top or the semiconductor wafer on the working surface and the probe board when the probes do not abut on the respective corresponding connection pads and is elastically deformable not to prevent abutment between the probes and the respective corresponding connection pads.

A probe card for an electric test of a device under test on a working table incorporating a heat source includes a circuit base plate including conductive paths connected to a tester, a probe base plate including conductive paths corresponding to the conductive paths and provided with probes connected to the conductive paths, and a heat expansion adjusting member bonded to the probe base plate, having a different linear expansion coefficient from that of the probe base plate to restrain heat expansion of the probe base plate, and constituting a composite body with the probe base plate. In a case where, when the device under test is at two measuring temperatures, the composite body is at corresponding achieving temperatures, expansion changing amounts of the device under test and the composite body under temperature differences between the respective measuring temperatures and the corresponding achieving temperatures are set to be approximately equal.

Probe card and method for manufacturing the same

An embodiment of a method for testing an integrated circuit comprises a first step for determining at least one of a group selected from whether or not the chuck top receiving the integrated circuit exists near a probe card which transmits and receives electrical signals to and from the integrated circuit, whether or not the integrated circuit is under testing, and whether or not the probe card has a given temperature, and a second step for adjusting power for heating to be supplied to a heating element provided in the probe card according to the determination result in the first step.

Method and apparatus for testing integrated circuit

The object of the present invention is to prevent an operator from touching electronic elements arranged on an upper surface of a probe assembly of an electrical connecting apparatus at the time of carrying the electrical connecting apparatus and to restrict bowing of the probe assembly caused by the temperature difference between the upper surface and the lower surface of the probe assembly. An electrical connecting apparatuscomprises a probe assembly having a plurality of contactorson a lower surface and a plurality of electronic elementsarranged on an upper surface, a coverarranged on the upper surface of the probe assembly so as to close a spacein which the electronic elements are arranged, and two grippersattached to the cover. Each gripperhas one endand the other end, has a region ranging from one end to the other end formed approximately in a U-shape, and is attached to a main body portionof the cover at both the ends.

Electrical connecting apparatus

A probe assembly for use in electrical measurement of a device under test. The probe assembly comprises a plate-like probe base plate with bending deformation produced in a free state without load, and a plurality of probes formed on one face of the probe base plate to project from the face. All the tips of the probes are positioned on the same plane parallel to an imaginary reference plane of the probe base plate.

Probe assembly, method of producing it and electrical connecting apparatus

A mounting apparatus that does not compromise the strength of a probe board. The apparatus comprises a probe board spaced from a support member by a spacer. A fixed portion with a female screw hole is mounted on one surface of the probe board. A male screw member is threaded into the screw hole for the purpose of tightening the support member to the probe board at a fixed distance defined by the length of the spacer. The probe board has a support plate. Pluralities of conductive paths penetrate the support plate. A wiring plate wherein wiring paths are connected to corresponding conductive paths, and whose one surface is fixed to the support plate. The other surface is provided with probes corresponding to the wiring paths. The fixed portion includes a female screw member at an area where no conductive paths are formed.

Probe board mounting apparatus

A wiring path of a circuit board has a first vertical path portion penetrating the circuit board at its outer edge in its thickness direction and connected to a connector on one surface, a second vertical path portion penetrating the circuit board in its thickness direction and connected to the electric coupler on the other surface, and a lateral path portion connecting both vertical portions, and the second vertical path portion is formed within an arrangement area (S) of a reinforcing plate. One connecting end portion (electric coupler side) of the wiring path of the circuit board is disposed within the arrangement area (S) of the reinforcing plate. On the other hand, the other connecting end portion (probe side) of the wiring path of the circuit board is disposed to be dispersed in an arrangement area (S) wider than the arrangement area (S) of the reinforcing plate.

An electrical connecting apparatus comprising: a circuit board on which a reinforcing plate is mounted and a plurality of first electric connections are provided; a probe board on which second electric connections corresponding to the first electric connections are provided, with a plurality of probes electrically connected to the corresponding second electric connections; an elastic connector having plural pairs of both contacts capable of contacting the first and second electric connections corresponding to each other of both boards therebetween and receiving a biasing force in directions for both contacts to separate from each other; screw members for integrally combining them; and a spacer member for holding the probe tips substantially on the same plane by tightening of the screw members. Between the reinforcing plate and the probe board, a spacer plate is inserted for adjusting a distance from the other surface of the probe board to the probe tips.

An electrical connecting device is disposed between a circuit board and a probe board opposing each other and used for connection between electrical connection terminals provided on the underside of said circuit board and electrical connection terminals provided on the probe board. In the electrical connecting device, an electrical insulating board has at least one of conductive earth patterns to be maintained at the earth potential on at least one selected from groups including the upside, underside and inside of the electrical insulating plate; a connecting pin disposed in each through hole of a first group is connected to the earth pattern, while a connecting pin disposed in each through hole of a second group is electrically separated from the earth pattern.

Growing community of inventors

Saitama, Japan

Hidehiro Kiyofuji