Sumitomo Electric Industries, Limited

Hidehiko Mishima

Kyoko Okita

Takashi Sakurada

Shunsaku Ueta

Eiryo Takasuka

Sho Sasaki

Hirokazu Eguchi

Naoki Kaji

Yasuhiro Okuda

Takashi Kasuga

Masaki Hashida

Shuji Sakabe

Kazuya Maruyama

Seiji Shimizu

In a case where a detector is positioned in a [11-20] direction, and where a first measurement region including a center of a main surface is irradiated with an X ray in a direction within &#xb1;15&#xb0; relative to a [&#x2212;1-120] direction, a ratio of a maximum intensity of a first intensity profile is more than or equal to 1500. In a case where the detector is positioned in a direction parallel to a [&#x2212;1100] direction, and where the first measurement region is irradiated with an X ray in a direction within &#xb1;6&#xb0; relative to a [1-100] direction, a ratio of a maximum intensity of a second intensity profile is more than or equal to 1500. An absolute value of a difference between maximum value and minimum value of energy at which the first intensity profile indicates a maximum value is less than or equal to 0.06 keV.

Silicon carbide single crystal substrate

A seal structure capable of achieving a waterproof structure at low cost while being flexibly adaptable to design change of a wire member, a method of forming the seal structure, a wire body and an electronic apparatus using them are provided. A seal structurefor sealing through holesof housingsin which a wire memberis inserted is configured to include a covering C that includes a spacer memberdisposed on one side of the through hole, secures the spacer member, the wire memberand the housingsto each other and seals them.

Seal structure, method of forming seal structure, wire body, and electronic apparatus

A processing method of forming a through-hole in a workpiece by means of a pulsed laser beam includes the steps of providing a removable sacrifice layer on the workpiece, forming a through-hole in the workpiece by the laser beam in a state where the sacrifice layer is provided, and removing the sacrifice layer from the workpiece after the step of forming the through-hole.

Product having through-hole and laser processing method

Growing community of inventors

Osaka, Japan

Hidehiko Mishima