Matsushita Electric Industrial Co., Ltd.

Hideaki Kunitake

Katsuyuki Ikenouchi

Mamoru Kanemoto

Yasunori Fukui

The substrate polishing method of the present invention can be used, in a substrate polishing apparatus having multiple carriers for one polishing pad, for determining a polishing time necessary to obtain a specific amount of polishing in polishing substrates using only some of the carriers among multiple carriers. In the present method, a correction coefficient indicating the correlation between the polishing time in polishing substrates using all the carriers and the polishing time in polishing substrates using only a part of the carriers is obtained in advance. The polishing time necessary for the specific amount of polishing in polishing substrates using only a part of the carriers is calculated based on the correction coefficient and the polishing time necessary for polishing the specific amount of polishing in polishing substrates using all of the carriers. By this, the amount of polishing of a factional number of substrates can be easily made to coincide with the amount of polishing of other substrates polished using all of the carriers.

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Toyama, Japan

Hideaki Kunitake