Other

Applied Materials, Inc.

Henry H Au

Steven M Zuniga

Gopalakrishna B Prabhu

Gregory E Menk

Erik S Rondum

Anand N Iyer

Garlen C Leung

Benjamin A Bonner

Peter McReynolds

A polishing apparatus is described. The polishing apparatus includes a rotatable platen, a drive mechanism to incrementally advance a polishing sheet having a polishing surface in a linear direction across the platen, a subpad on the platen to support the polishing sheet, the subpad having a groove formed therein, and a vacuum source connected to the groove of the subpad and configured to apply a vacuum sufficient to pull portions of the polishing sheet into the groove of the subpad to induce a groove in the polishing surface.

Polishing apparatus with grooved subpad

Accurate measurements of substrate surface curvature are effected by scanning the substrate in a scan direction along a diameter thereof and rotating it during rapid thermal processing (RTP). Rotation of the substrate also achieves more uniform heating of the substrate by exposing it uniformly to the radiant heat sources employed in the processing system. The heat sources are controllably energized in accordance with temperature measurements which provide feedback control for efficient and accurate cycling of the semiconductor wafer. Various methods are contemplated to effect the temperature measurement.

Scanning system for rapid thermal cycle stress/curvature measurement

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San Jose, CA, United States of America

Henry H Au