International Business Machines Corporation

Hematha K Wickramasinghe

Theodore Gerard Van Kessel

Matthew Earl Colburn

Yves Corfield Martin

Richard John Lebel

Paul H Smith, Jr

Fredrik Maurer

A method (and apparatus) for nano lithography, includes applying a pneumatic pressure to at least one of a surface of a semi-rigid mask or template and a portion of a surface of a resist-coated workpiece, and, by the applying of the pneumatic pressure, transferring a pattern from the mask to the workpiece.

Pneumatic method and apparatus for nano imprint lithography having a conforming mask

An apparatus (and method) for referencing a surface of a workpiece during imprint lithography, includes an air bearing for mechanically referencing a surface of the workpiece, and a lithographic template coupled to the air bearing.

Method and apparatus for direct referencing of top surface of workpiece during imprint lithography

A method (and apparatus) of replicating a pattern on a structure, includes using imprint lithography to replicate a pattern formed on a first structure onto a portion of a second structure.

Cut-and-paste imprint lithographic mold and method therefor

An optical probe (and method) for measuring a surface in an environment containing a first substance, includes a light source for transmitting a light onto an area of the surface to obtain a measurement, a source of the first substance including one of a fluid and a gas for displacing a second substance from an area of the surface receiving the light, and a measuring device for receiving the light being reflected from the surface and for determining a measurement of the surface based upon the reflected light.

Method and apparatus for optical film measurements in a controlled environment

An apparatus with one or more dimensions conforming to a wafer storage cassette used in semiconductor manufacturing which contains all or part of a sensor designed to measure a parameter of a wafer placed into the cassette. The intended use of the apparatus is in a process tool location normally occupied by a standard wafer cassette. By integrating all or part of the sensor into standard wafer storage cassette, a solution is provided whereby the same cassette and metrology system can be mechanically integrated into many process tools.

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San Jose, CA, United States of America

Hematha K Wickramasinghe