Wacker-chemitronic Gesellschaft Fur Elektronik-grundstoffe Mbh

Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag

Helmut Kirschner

Rudolf Griesshammer

Gunther Lechner

Thomas Buschhardt

Roland Brunner

Susanne Bauer-Mayer

Manfred Thurner

Heinrich Hennhofer

Hans Kramer

Klaus Rottger

Karl Pritscher

Wolfgang Heinke

Detlef Reimann

A process and device for polishing semiconductor wafers has at least one side of at least one semiconductor wafer pressed against a polishing plate, over which a polishing cloth is stretched. The semiconductor wafer and the polishing plate are moved relative to each other to polish the wafer. During the polishing, the semiconductor wafer passes over at least two regions on the polishing plate, which regions have defined radial widths and are at different temperatures. Temperature-control means are provided in the polishing plate, with the aid of which the number, the radial widths and the temperatures of the regions are fixed before the semiconductor wafers are polished.

Process and device for polishing semiconductor wafers

Silicon wafers can be provided with a hydrophilic surface and/or freed of hering cement residues originating from the polishing operation with the aid of solutions adjusted to a pH of 8 to 14 with the aid of alkali-metal or alkaline-earth-metal compounds and containing hydrogen peroxide. These processes can even be carried out at room temperature and are remarkable for their low chemical consumption and easy manageability.

Process for the hydrophilizing and/or cement-residue-removing surface

Process for making haze-free surfaces of semiconductor bodies which comprs a first step of polishing the surface by means of a polishing agent containing at least one member of the group consisting of quartz, silica, silicates and fluosilicates, and a second step of polishing the surface by means of a polishing agent containing in addition to the above defined agents from 0.1 to 10% by weight calculated on the polishing agent of a nitrogen-free surfactant selected from the group consisting of anionic and non-ionic surfactants, and a mixture thereof.

Nitrogen-free anionic and non-ionic surfactants in a process for

A stackable plastics pallet for packaging semiconductor discs on a gas-ti foil covering, said pallet having a plurality of circular depressions each for accommodating a semiconductor disc, and means for securing the discs between the pallets, the securing means being in the form of sloping part-sector shaped surfaces surrounding said depressions, with two opposite sets of sloping surfaces clamping the semiconductor discs at their outermost rims and immobilizing them thereby.

Packaging of semiconductor discs

Process of the removal of point defects and point defect agglomerates from emiconductor discs, which comprises the steps of providing one side of the discs with a mechanical stress field and then subjecting the discs to a heat treatment.

Process for the removal of specific crystal structure defects from

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Burghausen, Germany

Helmut Kirschner