Winbond Electronics Corporation

He-Hsuan Chao

Ping-Kun Wang

Ming-Che Lin

Chia-Wen Cheng

Chien-Min Wu

Frederick Chen

Shao-Ching Liao

Chang-Tsung Pai

Yi-Hsiu Chen

Seow Fong Lim

Chi-Ching Liu

Chia Hua Ho

Seow-Fong Lim

Po-Yen Hsu

Ngatik Cheung

Yu-Ting Chen

Chih-Cheng Fu

Norio Hattori

Tzu-Yun Huang

Chih-Hua Hung

Chen-Lung Huang

A manufacturing method is provided. The method includes steps below. Forming bottom electrodes. Blanketly forming a resistance switching layer on the bottom electrodes. Forming a first insulating material layer on the resistance switching layer. Patterning the first insulating material layer to form insulating patterns. Conformally forming a channel layer having a plurality of channel regions on the resistance switching layer and the insulating patterns, wherein the plurality of channel regions are located on the resistance switching layer and cover opposite sides of the insulating patterns. Forming a second electrode material layer on the channel layer. Patterning the second electrode material layer to form top electrodes, each of the top electrodes is located in corresponding to one of the insulating patterns and covers at least two of the plurality of channel regions.

Manufacturing method of resistive random access memory device

A resistive random access memory is provided. The resistive random access memory includes a bottom electrode, a metal oxide layer including a plurality of conductive filament regions formed on the bottom electrode, and a plurality of top electrodes formed on the metal oxide layer, corresponding to the respective conductive filament regions. Each of the conductive filament regions has a bottom portion and a top portion. The width of the bottom portion is greater than that of the top portion. The conductive filament regions include oxygen vacancies, and regions other than the conductive filament regions in the metal oxide layer are nitrogen-containing regions.

Resistive random access memories and method for fabricating the same

A write method for a resistive memory including a storage array, a control circuit and an access circuit is provided. The control circuit receives an external command to activate the access circuit to access the storage array. The write method includes determining whether the external command is ready to perform a write operation for the storage array; generating a first operation voltage group to the access circuit when the external command does not perform the write operation for the storage array; reading a count value of a block that corresponds to a write address when the external command performs the write operation for the storage array, wherein the count value indicates the number of times that the block corresponding to the write address performs the write operation; and generating a second operation voltage group to the access circuit according to the count value of the block.

Write method for resistive memory

A resistive random access memory (RRAM) device and a manufacturing method are provided. The RRAM device includes bottom electrodes, a resistance switching layer, insulating patterns, a channel layer and top electrodes. The resistance switching layer blanketly covers the bottom electrodes. The insulating patterns are disposed on the resistance layer and located in corresponding to locations of the bottom electrodes. The channel layer conformally covers the resistance switching layer and the insulating patterns. The channel layer has a plurality of channel regions. The channel regions are located on the resistance switching layer, and cover sidewalls of the insulating patterns. The top electrodes respectively cover at least two of the channel regions, and respectively located in corresponding to one of the insulating patterns, such that the at least two of the channel regions are located between one of the bottom electrodes and one of the top electrodes.

Resistive random access memory device and manufacturing method thereof

A resistive memory device and a reliability enhancement method thereof are provided. The reliability enhancement method includes the following steps. A forming operation is performed on a plurality of memory cells. The formed memory cells are read to respectively obtain a plurality of formed currents. A reference current is set according to a statistic value of the formed currents. A setting operation is performed on the memory cells. A ratio between a set current of each of the memory cells and the reference current is calculated, and a physical status of each of the memory cells is judged according to the ratio. It is determined whether to perform a fix operation of each of the memory cells or not according to physical status.

Resistive memory device and reliability enhancement method thereof by using ratio of set current and reference current

A resistive memory including a storage array, a storage circuit, a control circuit, a voltage generation circuit and an access circuit is provided. The storage array includes a plurality of blocks. Each block includes a plurality of memory cells. The storage circuit stores a plurality of count values. Each of the count values indicates the number of times that a corresponding block performs a write operation. The control circuit generates a control signal according to the count values when an external command is a write command. The voltage generation circuit provides an operation voltage group according to the control signal. The access circuit accesses the storage array according to the operation voltage group.

Resistive memory

A data write-in method and a non-volatile memory are provided. The data write-in method includes: providing a reset voltage to a plurality of selected memory cells according to a first flag, and recursively performing a reset process for the plurality of selected memory cells; setting a second flag according to a plurality of first verification currents of the plurality of selected memory cells; and under a condition that the second flag is set: providing a set voltage to the plurality of selected memory cells according to a resistance of the plurality of selected memory cells; and setting the first flag according to a plurality of second verification currents of the plurality of selected memory cells.

Data write-in method and non-volatile memory

A resistive memory and a method for writing data thereof are provided. The method for writing data includes: receiving a write-in data and generating an inverted write-in data; reading a current data in a plurality of selected memory cells; comparing the current data with the write-in data and the inverted write-in data; selecting the write-in data or the inverted write-in data to generate a final data according to a comparison result; and writing the final data into the selected memory cells.

Resistive memory apparatus and method for writing data thereof

A memory storage apparatus and a forming method of a resistive memory device thereof are provided. A test forming voltage is applied to a redundant resistive memory device and a corresponding test current is read. A forming voltage applied to a main memory cell block is determined according to the test forming voltage, the test current, a forming current-voltage characteristic data and a target forming current.

Memory storage apparatus and forming method of resistive memory device thereof

A non-volatile memory and a reset method thereof are provided. The reset method includes: performing a first reset operation on a plurality of memory cells; recording a plurality of first verifying currents respectively corresponding to a plurality of first failure memory cells; performing a second reset operation on the first failure memory cells, and verifying second failure memory cells to obtain a plurality of second verifying currents; setting a first voltage modify flag according to a plurality of first ratios between the first verifying currents and the respectively corresponding second verifying currents; and adjusting a reset voltage for performing the first reset operation and the second reset operation according to the first voltage modify flag.

Non-volatile memory and reset method thereof

A resistive memory including a first storage circuit, a verification circuit, a second storage circuit and a control circuit is provided. The first storage circuit includes various cell groups. Each of the cell groups includes at least one memory cell. The verification circuit is coupled to the first storage circuit to verify whether a specific operation performed on at least one of the memory cells was successful. The second storage circuit includes various flag bits. Each of the flag bits corresponds to a cell group. In a reset period, the control circuit is configured to perform a first reset operation or a second reset operation on a first memory cell of a specific cell group among the cell groups according to a specific flag bit corresponding to the specific cell group.

Resistive memory and control method thereof

A method for forming a resistive random access memory includes forming a layer stack, patterning the layer stack to form a plurality of stack structures, forming a protection layer along sidewalls of the plurality of stack structures, forming a first isolation structure between the plurality of stack structures, forming at least one recess in at least one stack structure to define a plurality of filament units, and forming a second isolation structure in the at least one recess. The layer stack includes a bottom electrode and a resistive switching layer on the bottom electrode.

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Taichung, Taiwan

He-Hsuan Chao