Jsr Corporation

Seiko Epson Corporation

Japan Synthetic Rubber Co., Ltd.

Haruo Iwasawa

Tsutomu Shimokawa

Akihiro Hayashi

Yasuo Matsuki

Toru Kajita

Mitsuhito Suwa

Masafumi Yamamoto

Shin-ichiro Iwanaga

Satoru Nishiyama

Hiroyuki Ishii

Hitoshi Kato

Masato Tanaka

Tomoki Nagai

Yukio Nishimura

Masahiro Furusawa

Takashi Aoki

Tatsuya Sakai

Yong Wang

Kiyoshi Murata

Eiji Yoneda

Satoshi Ebata

Kazuo Kawaguchi

Tatsuya Toneri

Shinichiro Iwanaga

Noboru Yamahara

Daohai Wang

Yasumasa Kateuchi

There are provided a composition and method for forming a silicon-cobalt film at low production cost without expensive vacuum equipment and high-frequency generator. The composition is a silicon-cobalt film forming composition comprising a silicon compound and a cobalt compound. A silicon-cobalt film is formed by applying this composition on a substrate and subjecting the resulting substrate to a heat treatment and/or a light treatment.

Composition for forming silicon-cobalt film, silicon-cobalt film and method for forming same

There are provided a silicon-film-forming composition containing silicon particles and a dispersion medium and a method for forming a silicon film by forming a coating film of the silicon-film-forming composition on a substrate and subjecting the coating film to instantaneous fusion, a heat treatment or a light treatment. According to the composition and the method, a polysilicon film with a desired thickness which may be used as a silicon film for a solar battery can be formed efficiently and easily.

Composition for forming silicon film and method for forming silicon film

A radiation-sensitive resin composition comprising (A) an acid-dissociable group-containing polysiloxane and (B) a photoacid generator containing trifluoromethane sulfonic acid or a compound which generates an acid of the following formula (I), wherein Rf individually represents a fluorine atom or a trifluoromethyl group, and Ra represents a hydrogen atom, a fluorine atom, a linear or branched alkyl group having 1-20 carbon atoms, or a linear or branched fluoroalkyl group having 1-20 carbon atoms, a substituted or unsubstituted monovalent cyclic hydrocarbon group having 3-20 carbon atoms, or a substituted or unsubstituted monovalent cyclic fluoro-hydrocarbon group having 3-20 carbon atoms. The radiation-sensitive resin composition of the present invention exhibits superior resolution, while maintaining high transparency to radiations and high dry etching resistance. The resin composition thus can greatly contribute to the lithography process that will become more and more minute in the future.

Radiation-sensitive resin composition

A pattern forming method comprising forming a coating of a radiation-sensitive resin composition, which contains an acid-dissociable group-containing polysiloxane, alkali-insoluble or scarcely alkali-soluble but becoming alkali-soluble when the acid-dissociable group dissociates, on a film containing a polymer with a carbon content of 80 wt % or more and a polystyrene-reduced weight average molecular weight of 500&#x2013;100,000, an applying radiation to the coating is provided. The method can form minute patterns with a high aspect ratio by suitably selecting a specific etching gas in the dry etching process, without being affected by standing waves.

Pattern forming method and bilayer film

It is an object of the present invention to provide a high order silane composition that contains a polysilane having a higher molecular weight than conventionally, this being from the viewpoints of wettability when applying onto a substrate, boiling point and safety, and hence in particular enables a high-quality silicon film to be formed easily, and also a method of forming an excellent silicon film using the composition. The present invention attains this object by providing a high order silane composition containing a polysilane obtained through photopolymerization by irradiating a solution of a photopolymerizable silane or a photopolymerizable like-liquid silane with ultraviolet light. Moreover, the present invention provides a method of forming a silicon film comprising the step of applying such a high order silane composition onto a substrate.

High order silane composition, and method of forming silicon film using the composition

A novel polysiloxane having high transparency to radiations with a wavelength of 193 nm or less, particularly 157 nm or less, and exhibiting superior dry etching resistance and a radiation-sensitive resin composition comprising the polysiloxane exhibiting superior sensitivity, resolution, and the like are provided. The polysiloxane is a resin having the structural unit (I) and/or structural unit (II) of the following formula (1), and having an acid-dissociable group, wherein Rrepresents a monovalent aromatic group substituted with a fluorine atom or a fluoroalkyl group or a monovalent aliphatic group substituted with a fluorine atom or a fluoroalkyl group and Rrepresents the above a monovalent aromatic group, the above monovalent aliphatic group, a hydrogen atom, a monovalent hydrocarbon group, haloalkyl group, or amino group. The radiation-sensitive resin composition (A) comprises the polysiloxane (A) and the photoacid generator (B) 

Polysiloxane, process for production thereof and radiation-sensitive resin composition

A novel photoacid generator containing a structure of the following formula (I),wherein R is a monovalent organic group with a fluorine content of 50 wt % or less, a nitro group, a cyano group, or a hydrogen atom, and Zand Zare individually a fluorine atom or a linear or branched perfluoroalkyl group having 1-10 carbon atoms, is provided. When used in a chemically amplified radiation-sensitive resin composition, the photoacid generator exhibits high transparency, comparatively high combustibility, and no bioaccumulation, and produces an acid exhibiting high acidity, high boiling point, moderately short diffusion length in the resist coating, and low dependency to mask pattern density.

Acid generator, sulfonic acid, sulfonic acid derivatives and radiation-sensitive resin composition

A novel polysiloxane having the following structural units (I) and/or (II) and the structural unit (III),wherein Aand Aare an acid-dissociable monovalent organic group, Ris hydrogen, monovalent (halogenated) hydrocarbon, halogen, or amino, Ris monovalent (halogenated) hydrocarbon group, or halogen. A method of preparing such a polysiloxane, a silicon-containing alicyclic compound providing this polysiloxane, and a radiation-sensitive resin composition comprising this polysiloxane are also provided. The polysiloxane is useful as a resin component for a resist material, effectively senses radiation with a short wavelength, exhibits high transparency to radiation and superior dry etching properties, and excels in basic resist properties required for resist materials such as high sensitivity, resolution, developability, etc.

Polysiloxane, method of manufacturing same, silicon-containing alicyclic compound, and radiation-sensitive resin composition

The present invention provides a radiation sensitive resin composition which comprises (A) a resin represented by a copolymer comprising recurring units represented by the general formulae (1) or (2) as shown below, and (B) a radiation sensitive acid-generator. The radiation sensitive resin composition has an excellent storage stability and the resist produced from the composition is a chemically amplifiable type sensitive to radiations represented by fartificial ultraviolet rays. The resist has a high transparency to radiations and it is excellent in basic physical properties for resist such as durability to dry etching, sensitivity, resolution, and pattern configuration: 

Radiation sensitive resin composition

A positive-tone or negative-tone radiation sensitive resin composition comprising (A) a photoacid generator represented by the following formula (1-1) or (1-2):

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Tokyo, Japan

Haruo Iwasawa