Tokyo Electron Limited

Kao Corporation

Haruna Suzuki

Naoki Shindo

Gen You

Satoshi Toda

Mitsuhiro Tachibana

Shinobu Nagase

Azusa Nishimura

An etching method includes: providing, within a chamber, a substrate that includes at least a silicon-containing material and a molybdenum film or a tungsten film which is in an exposed state, and selectively etching the molybdenum film or the tungsten film relative to the silicon-containing material by supplying, into the chamber, an oxidation gas and a hexafluoride gas as an etching gas.

Etching method and etching apparatus

An etching method includes preparing a substrate in which titanium nitride and molybdenum or tungsten are present, and etching the titanium nitride by supplying a processing gas including a ClFgas and a Ngas to the substrate, wherein in the etching the titanium nitride, a partial pressure ratio of the ClFgas to the Ngas in the processing gas is set to a value at which grain boundaries of the molybdenum or the tungsten are nitrided to such an extent that generation of a pitting is suppressed.

An etching method includes: providing, in a chamber, a substrate including a structure including a first film selected from a molybdenum film and a tungsten film; performing a first etching on the first film by supplying an oxidation gas and a first gas selected from a MoFgas and a WFgas into the chamber; when a pore present inside the first film is exposed by the first etching, filling the pore with one of molybdenum and tungsten by stopping the first etching and supplying a reduction gas and a second gas selected the MoFgas and the WFgas into the chamber; and performing a second etching on a filling layer formed in the filling and the first film by supplying the oxidation gas and a third gas selected from the MoFgas and the WFgas into the chamber.

A multi-agent type hair treatment agent comprising a first composition containing component (A) and component (B); and a second composition containing component (C), wherein the weight ratio (H)/(C) of component (H) to component (C) in the second composition is less than 1. A hair treatment method comprising the steps of applying and rinsing the first composition to hair (i) and then applying the second composition to hair (ii).

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Tokyo, Japan

Haruna Suzuki