Hitachi, Ltd.

Haruhiko Tanaka

Masahiro Moniwa

Toru Kaga

Atsushi Hiraiwa

Eiji Takeda

ShinIchiro Kimura

Dai Hisamoto

Hajime Akimoto

Toshifumi Ozaki

Hideyuki Ono

Kazuya Tokumasu

A semiconductor device such as FET or charge coupled device, having a channel or a charge coupled portion provided in a thin semiconductor layer which is nearly perpendicular to the substrate and to which the necessary electrode such as the gate electrode and the necessary insulating layer are added can maintain the necessary amount of electric current by securing the height of the semiconductor layer and also can have its plane size reduced minutely. Further, the semiconductor memory device using the above semiconductor device is suitable to high integration and has excellent electric characteristics.

Method of manufacturing a semiconductor device having silicon islands

An improved method for manufacturing an insulated gate field effect transistor is provided. As a first step, a silicon oxide film is grown on a silicon substrate, and a first silicon nitride film is deposited thereon. The first silicon nitrite film, the silicon oxide film and the silicon substrate are then etched using a resist pattern as a mask to form a silicon island which includes at least a part of the silicon substrate. A second silicon oxide film is then grown on the surface of the silicon substrate exposed by the second step, as well as on the surface of the silicon island, and a second silicon nitrite film is deposited thereon. The second silicon nitrite film is then etched to leave a portion of the second silicon nitrite film deposited on a side wall of the silicon island. After this, a third silicon oxide film is grown by thermal oxidation of the surface of the silicon substrate to electrically separate the silicon island from the silicon substrate. Next a gate electrode is formed on silicon island, followed by forming source and drain regions in the silicon island employing the gate electrode as a mask.

Method for manufacturing a semiconductor device and a semiconductor

A semiconductor device, such as an FET or a charge coupled device, is provided having a channel or a charge coupled portion formed in a thin semiconductor layer which is substantially perpendicular to the substrate. Necessary electrodes, such as the gate electrode, and necessary insulating layers can be added at the thin semiconductor layer, and can maintain the necessary amount of electric current by securing the height of the semiconductor layer. The structure has the advantage that it can have its plane size reduced. Further, the semiconductor memory device using the above semiconductor device is suitable to high integration and has excellent electric characteristics.

Semiconductor device and semiconductor memory device

The semiconductor device having both vertically arranged CCDs and a horizontal CCD, such as, in connection with a solid state image pickup device, is provided with a horizontal CCD in which the transfer speed and the transfer efficiency of a horizontal CCD thereof is improved substantially. In such a device, a plurality of photodiodes are provided on a semiconductor substrate, vertical CCDs are provided on the semiconductor substrate for transferring signal charges of the photodiodes and a horizontal CCD is provided on the semiconductor substrate for transferring signal charges received from the vertical CCDs. The vertical and horizontal CCDs of such a semiconductor device are formed in a well structure provided on the substrate such that the depletion region extending from the channel of the horizontal CCD and a depletion region produced between the underlying substrate and the well are configured to meet each other under each of the transfer electrodes of the horizontal CCD. The depletion region extending from a channel of the vertical CCDs and the depletion region produced between the underlying substrate and the well, however, do not meet each other under each of the transfer electrodes thereof.

Semiconductor imaging device having a plurality of photodiodes and

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Kokubunji, Japan

Haruhiko Tanaka