Ngk Spark Plug Company, Limited

Haruhiko Murata

Kazuo Kimura

Kazuhisa Sato

Yukihiro Aoyama

Yukihiro Kimura

Hisashi Wakako

Masahiro Iba

Kenzo Kawaguchi

Kazuyuki Takahashi

Tomonori Matsuura

Masashi Inaishi

A wiring board comprising: a wiring laminate portion including dielectric layers containing polymeric material and conductor layers laminated alternately so as to form a first main surface out of one of said dielectric layers; and a plurality of metal terminal pads disposed on said first main surface; wherein: each of said metal terminal pads has a structure in which a Cu-plated layer is disposed on a side of said first main surface and an Au-plated layer is disposed in an outermost surface layer portion of said metal terminal pad, while an electroless Ni-plated layer having a P content not higher than 3% by weight is disposed as a barrier metal layer between said Cu-plated layer and said Au-plated layer.

Wiring board

A circuit board having a plurality of solder bumps is provided. The solder bumps are flattened and leveled at the tops so that the coplanarity of the solder bumps is 0.5 &mgr;m or less per 1 mm. The flattened and leveled tops of the solder bumps are formed by cold pressing, hot pressing or grinding. Method of forming such solder bumps and jigs used for carrying out such methods are also provided.

Circuit board having solder bumps

A printed-wiring substrate includes internal dielectric resin layers and . A main-surface-side external dielectric resin layer is formed on the internal dielectric resin layer such that the surface thereof serves as a substrate main-surface A. A back-surface-side external dielectric resin layer is formed on the internal dielectric resin layer such that the surface thereof serves as a substrate back-surface B. A surface A of the main-surface-side internal dielectric resin layer and a surface A of the back-surface-side internal dielectric resin layer are roughened. The substrate main-surface A and the substrate back-surface B are roughened such that surface roughness thereof is lower than that of the surfaces A and A.

Printed-wiring substrate and method for fabricating the same

A ceramic lid assembly includes an integral metallized layer provided around the periphery of a ceramic lid substrate to serve as a foundation for a solder layer. A portion of the metallized layer for contact with the ceramic lid substrate is formed from a metallized paste containing glass frits so that the metallized layer is baked to adhere to the ceramic lid by reflowed glass frits. A portion of the metallized layer for contact with the solder layer is formed from a metallized paste containing no glass frits so that substantially no void is formed in the solder layer.

Ceramic lid assembly for semiconductor packages

In a ceramic lid for a semiconductor package, a metallized layer is generally uniform in width and has at least one increased or reduced width portion or a plurality of increased or reduced width portions which are arranged in intervals.

Growing community of inventors

Aichi, Japan

Haruhiko Murata