Micron Technology Incorporated

Honeywell International Inc.

Harry Liu

Shaoping Li

Theodore Zhu

William L Larson

Yong Lu

Anthony Arrott

Lonny L Berg

Joel A Drewes

Romney R Katti

Michael S Liu

A passivated magneto-resistive bit structure is disclosed in which surfaces subjects to oxidation or corrosion are protected. In one embodiment, a bit structure is encapsulated by means of an etch stop barrier material. In another embodiment an etch stop barrier material protects the top of a bit structure and dielectric spacers protect the side walls.

Passivated magneto-resistive bit structure and passivation method therefor

A method and system is disclosed for preventing write errors in a Single Event Upset (SEU) hardened static random access memory (SRAM) cell. A compensating element has been connected to a feedback path of the SRAM cell. The compensating element operates to cancel out capacitive coupling generated in an active delay element of the SRAM cell. If the compensating element sufficiently cancels the effects of the capacitive coupling, a write error will not occur in the SRAM cell. The compensating element also occupies a smaller silicon area than other proposed solutions.

Radiation-hardened SRAM cell with write error protection

A method and system is disclosed for reducing proton and heavy ion SEU sensitivity of a static random access memory (SRAM) cell. A first passive delay element has been inserted in series with an active delay element in a first feedback path of the SRAM cell, and a second passive delay element has been inserted in a second feedback path of the SRAM cell. The passive delay elements reduce the proton SEU sensitivity of the SRAM cell, and the active delay element reduces the heavy ion sensitivity of the SRAM cell. The passive delay elements also protect the SRAM cell against SEUs that may occur when the SRAM cell is in dynamic mode.

Proton and heavy ion SEU resistant SRAM

A magnetic bit structure for a magneto-resistive memory is disclosed that has bit ends that are sufficiently large to accommodate a minimum size contact or via hole. By providing such an arrangement, the magnetic bit structure may be fabricated using conventional contact and/or via processing steps. As such, the cost of manufacturing the device may be reduced, and the overall achievable yield may be increased.

Method for manufacture of magneto-resistive bit structure

MRAM architectures are disclosed that produce an increased write margin and write selectivity without significantly reducing the packing density of the memory. The major axes of the magneto-resistive bits are offset relative to the axes of the digital lines to produce a magnetic field component from the digital line current that extends along the major axis of the magneto-resistive bits.

Methods of increasing write selectivity in an MRAM

Passivated magneto-resistive bit structure

Magneto-resistive bit structure and method of manufacture therefor

MRAM architectures for increased write selectivity

MRAM architecture using offset bits for increased write selectivity

A passivated magneto-resistive bit structure is disclosed in which surfaces subject to oxidation or corrosion are protected. In one embodiment a bit structure is encapsulated by means of an etch stop barrier material. In another embodiment an etch stop barrier material protects the top of a bit structure and dielectric spacers protect the side walls.

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Plymouth, MN, United States of America

Harry Liu