Intel Corporation

Daedalus Prime LLC

Harold W Kennel

Tahir Ghani

Jack T Kavalieros

Willy Rachmady

Anand S Murthy

Gilbert W Dewey

Matthew V Metz

Glenn A Glass

Sean T Ma

Cheng-Ying Huang

Van H Le

Benjamin Chu-Kung

Chandra S Mohapatra

Seung Hoon Sung

Stephen M Cea

Ashish Agrawal

Ravi Pillarisetty

Aaron D Lilak

Nicholas G Minutillo

Cory E Weber

Roza Kotlyar

Niloy Mukherjee

Rishabh Mehandru

Mark Y Liu

Robert G James

Justin R Weber

Siddharth Chouksey

Dipanjan Basu

Jacob M Jensen

Robert S Chau

Kelin J Kuhn

Abhishek A Sharma

Mauro J Kobrinsky

Mark Armstrong

Paul A Packan

Scott E Thompson

Chi-hing Choi

Debaleena Nandi

Marko Radosavljevic

Sansaptak W Dasgupta

Patrick R Morrow

Karthik Jambunathan

Niti Goel

Nazila Haratipour

Jack Hwang

Sridhar Govindaraju

Aravind S Killampalli

Michael J Jackson

Karson Knutson

Omair Saadat

Adedapo A Oni

Paul B Fischer

Christopher J Jezewski

Cory C Bomberger

Dax M Crum

Nancy M Zelick

Arnab Sen Gupta

Ryan Keech

Jessica M Torres

Varun Mishra

Yang Cao

Devin Merrill

Jitendra Kumar Jha

Anant H Jahagirdar

Subrina Rafique

Rushabh Shah

Peng Zheng

Will Rachmady

Imola Zigoneanu

Pratik Patel

Integrated circuit structures having source or drain structures with low resistivity are described. In an example, integrated circuit structure includes a fin having a lower fin portion and an upper fin portion. A gate stack is over the upper fin portion of the fin, the gate stack having a first side opposite a second side. A first source or drain structure includes an epitaxial structure embedded in the fin at the first side of the gate stack. A second source or drain structure includes an epitaxial structure embedded in the fin at the second side of the gate stack. Each epitaxial structure of the first and second source or drain structures include silicon, germanium, gallium and boron. The first and second source or drain structures have a resistivity less than 2E-9 Ohm cm.

SiGe:GAB source or drain structures with low resistivity

Integrated circuitry comprising interconnect metallization on both front and back sides of a gate-all-around (GAA) transistor structure lacking at least one active bottom channel region. Bottom channel regions may be depopulated from a GAA transistor structure following removal of a back side substrate that exposes an inactive portion of a semiconductor fin. During back-side processing, one or more bottom channel region may be removed or rendered inactive through dopant implantation. Back-side processing may then proceed with the interconnection of one or more terminal of the GAA transistor structures through one or more levels of back-side interconnect metallization.

Double-sided integrated circuit transistor structures with depopulated bottom channel regions

Source and drain contacts that provide improved contact resistance and contact interface stability for transistors employing silicon and germanium source and drain materials, related transistor structures, integrated circuits, systems, and methods of fabrication are disclosed. Such source and drain contacts include a contact layer of co-deposited titanium and silicon on the silicon and germanium source and drain. The disclosed source and drain contacts improve transistor performance including switching speed and reliability.

Co-deposition of titanium and silicon for improved silicon germanium source and drain contacts

Embodiments disclosed herein include semiconductor devices with improved contact resistances. In an embodiment, a semiconductor device comprises a semiconductor channel, a gate stack over the semiconductor channel, a source region on a first end of the semiconductor channel, a drain region on a second end of the semiconductor channel, and contacts over the source region and the drain region. In an embodiment, the contacts comprise a silicon germanium layer, an interface layer over the silicon germanium layer, and a titanium layer over the interface layer.

Low germanium, high boron silicon rich capping layer for PMOS contact resistance thermal stability

A device is disclosed. The device includes a channel, a first source-drain region adjacent a first portion of the channel, the first source-drain region including a first crystalline portion that includes a first region of metastable dopants, a second source-drain region adjacent a second portion of the channel, the second source-drain region including a second crystalline portion that includes a second region of metastable dopants. A gate conductor is on the channel.

Amorphization and regrowth of source-drain regions from the bottom-side of a semiconductor assembly

Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, integrated circuit structures having germanium-based channels are described. In an example, an integrated circuit structure includes a fin having a lower silicon portion, an intermediate germanium portion on the lower silicon portion, and a silicon germanium portion on the intermediate germanium portion. An isolation structure is along sidewalls of the lower silicon portion of the fin. A gate stack is over a top of and along sidewalls of an upper portion of the fin and on a top surface of the isolation structure. A first source or drain structure is at a first side of the gate stack. A second source or drain structure is at a second side of the gate stack.

Integrated circuit structures having germanium-based channels

Material systems for source region, drain region, and a semiconductor body of transistor devices in which the semiconductor body is electrically insulated from an underlying substrate are selected to reduce or eliminate a band to band tunneling ('BTBT') effect between different energetic bands of the semiconductor body and one or both of the source region and the drain region. This can be accomplished by selecting a material for the semiconductor body with a band gap that is larger than a band gap for material(s) selected for the source region and/or drain region.

Reducing off-state leakage in semiconductor devices

Techniques are disclosed for integrating semiconductor oxide materials as alternate channel materials for n-channel devices in integrated circuits. The semiconductor oxide material may have a wider band gap than the band gap of silicon. Additionally or alternatively, the high mobility, wide band gap semiconductor oxide material may have a higher electron mobility than silicon. The use of such semiconductor oxide materials can provide improved NMOS channel performance in the form of less off-state leakage and, in some instances, improved electron mobility as compared to silicon NMOS channels.

High performance semiconductor oxide material channel regions for NMOS

Semiconductor nanowire devices having (111)-plane channel sidewalls and methods of fabricating semiconductor nanowire devices having (111)-plane channel sidewalls are described. For example, an integrated circuit structure includes a first semiconductor device including a plurality of vertically stacked nanowires disposed above a substrate, each of the nanowires comprising a discrete channel region having <111> lateral sidewalls along a <110> carrier transport direction. The integrated circuit structure also includes a second semiconductor device including a semiconductor fin disposed above the substrate, the semiconductor fin having a channel region with a top and side surfaces, the channel region having <111> lateral sidewalls along a <110> carrier transport direction.

Semiconductor nanowire device having (111)-plane channel sidewalls

Integrated circuit structures having source or drain structures and germanium N-channels are described. In an example, an integrated circuit structure includes a fin having a lower fin portion and an upper fin portion, the upper fin portion including germanium. A gate stack is over the upper fin portion of the fin. A first source or drain structure includes an epitaxial structure embedded in the fin at a first side of the gate stack. A second source or drain structure includes an epitaxial structure embedded in the fin at a second side of the gate stack. Each epitaxial structure includes a first semiconductor layer in contact with the upper fin portion, and a second semiconductor layer on the first semiconductor layer. The first semiconductor layer comprises silicon, germanium and phosphorous, and the second semiconductor layer comprises silicon and phosphorous.

Source or drain structures for germanium N-channel devices

Techniques are disclosed for an integrated circuit including a ferroelectric gate stack including a ferroelectric layer, an interfacial oxide layer, and a gate electrode. The ferroelectric layer can be voltage activated to switch between two ferroelectric states. Employing such a ferroelectric layer provides a reduction in leakage current in an off-state and provides an increase in charge in an on-state. The interfacial oxide layer can be formed between the ferroelectric layer and the gate electrode. Alternatively, the ferroelectric layer can be formed between the interfacial oxide layer and the gate electrode.

Ferroelectric gate stack for band-to-band tunneling reduction

Disclosed herein are tri-gate transistor arrangements, and related methods and devices. For example, in some embodiments, a transistor arrangement may include a fin stack shaped as a fin extending away from a base, and a subfin dielectric stack. The fin includes a subfin portion and a channel portion, the subfin portion being closer to the base than the channel portion. The subfin dielectric stack includes a transistor dielectric material, and a fixed charge liner material disposed between the transistor dielectric material and the subfin portion of the fin.

Subfin leakage suppression using fixed charge

An apparatus including a transistor device disposed on a surface of a circuit substrate, the device including a body including opposing sidewalls defining a width dimension and a channel material including indium, the channel material including a profile at a base thereof that promotes indium atom diffusivity changes in the channel material in a direction away from the sidewalls. A method including forming a transistor device body on a circuit substrate, the transistor device body including opposing sidewalls and including a buffer material and a channel material on the buffer material, the channel material including indium and the buffer material includes a facet that promotes indium atom diffusivity changes in the channel material in a direction away from the sidewalls; and forming a gate stack on the channel material.

Indium-containing fin of a transistor device with an indium-rich core

Growing community of inventors

Portland, OR, United States of America

Harold W Kennel