Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh

Other

Hans-Adolf Gerber

Franz Kuhn-Kuhnenfeld

Josef Kramler

R&uuml;diger Schmolke

Dieter Gr&auml;f

Robert Kerschreiter

Monique Suhren

Anton Luger

The invention relates to a reproducible standard for calibrating and checking the bright-field channel of a surface inspection device used for examining the flat surface of a sample and to a method for producing said standard whereby a microstructure is produced on a surface of a substrate provided as a standard, characterized in that the microstructure is smoothed out.

Standard for calibrating and checking a surface inspection device and method for the production thereof

For the manufacture of semiconductor wafers with a rear side having a geting action in subsequent oxidation processes by means of the action of light, especially laser, radiation ('laser damage'), there are advantageously chosen wafers with a fine surface structure that contains faces that are inclined by at least 15.degree. in the actual profile by comparison with the geometrically ideal profile of the surface according to known standards. As a result, in comparison to smooth surfaces, considerable savings in energy and time are achieved.

Process for the manufacture of semiconductor wafers with a rear side

A method for producing contrast rich, permanent and slag-free characterizations, particularly on polished semiconductor disks is described, in which the surface for generating the surface pattern is partially melted by laser radiation. According to the invention, a surface segment corresponding to 1.5 to 6.5 times the surface area of the desired surface pattern is irradiated, and the semiconductor material is caused to melt and partially vaporize only in the center thereof.

Method of making reference surface markings on semiconductor wafers by

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Burghausen, Germany

Hans-Adolf Gerber