Mitsubishi Materials Corporation

Hanako Hata

Tsutomu Takahashi

Tetsuji Yamashita

Naoki Shimomae

Takashi Kimura

A CMP conditioner is provided in which diamond grit that is adhered to a conditioning surface so as to face and be in contact with a polishing pad of a CMP apparatus is adhered such that 111 surfaces of crystal surfaces of the diamond grit are substantially parallel with the conditioning surface and face in a direction faced by the conditioning surface.

CMP conditioner

Objectives: To improve the cutting sharpness and life while the manufacturing cost is being lowered. Solution mechanism: The whetstone particle layer (), which consists of multiple whetstone particle layer units (), . . . , is configured on the surface () of the whetstone substrate () while the respective whetstone particle layer units () are being mutually linked via the bridge unit (). The non-whetstone particle unit () is configured between whetstone particle layer units () and (). Whetstone particle layer unit () is obtained by configuring the superwhetstone particles () densely in the central unit () and by configuring them sparsely in the peripheral unit (). The metal coupling phase (), to which the superwhetstone particles () are fixed, is formed by the first and second metal plate phases () and (), respectively. The thickness of the first metal plate phase () decreases from the central unit () toward the peripheral unit () in the shape of a mountain.

Electroplated grinding wheel and its production equipment and method

In the electrodeposited abrasive wheel of the abrasive tool according to the present invention, plural mound parts which are upheaved at the central domain of base metal in almost columnar shape, are arranged mostly in the shape of lattice. An abrasive grain layer is formed on a base metal and plural ultra abrasive grains are adhered only to each mound parts by electrodeposited metal phase and referred as the small abrasive-grain-layer parts 24, respectively. Ultra abrasive grains are laid out at corner R part and top of the mound parts at the small abrasive-grain-layer parts Ultra abrasive grains at each small abrasive-grain-layer parts are set as 11-500 pieces, and the rate which ultra abrasive grains occupy to the whole area of abrasive grain layer accounted by plane projection is set as 20%-80% of the range. At the time of grinding, only ultra abrasive grains contact to grinding work piece, then high abutment pressure is maintained, and sharpness and the discharge performance of ground wastes are good.

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Iwaki, Japan

Hanako Hata