Phicom Corporation

Han-Moo Lee

Yong-Hwi Jo

Disclosed is a method of fabricating a cantilever type probes. According to this method, after forming grooves each in tip portion and dummy tip portion regions of a substrate, the tip portion and dummy tip portion are formed with filling the grooves of the tip portion and dummy tip portion regions. A sacrificial layer is formed to cover the dummy tip portion region including dummy tip portion. A beam portion is formed in connection with the tip portion, extending upward the dummy tip portion including the sacrificial layer. The method includes steps of selectively etching the substrate of the tip portion and floating the tip portion from the substrate. Accordingly, it minimizes physical and chemical damages on the tip portion while fabricating a probe card, providing stability thereto with smaller defects of the tip portion.

Method of fabricating cantilever type probe and method of fabricating probe card using the same

A probe card is disclosed that is easily assembled and maintained and configured to prevent the controlled level of a space transformer from changing due to various causes such as a thermal deformation during a test process. The probe card includes an installation member where probe tips are provided and a printed circuit board (PCB) disposed on the installation member. A reinforcement member is fixed to a top surface of the PCB, and a contact member is disposed between the PCB and the reinforcement member. The contact member and the installation member are fixed by a connect member inserted into an insert hole formed at the PCB, and a control bolt provided for controlling the level of the installation member is inserted into control holes formed at the installation member, the PCB, and the reinforcement member sequentially in a bottom-to-top direction. Due to a convex-up top surface of the contact member, the contact member continues to contact the reinforcement member even though the installation member and the contact member are inclined while controlling the level of the installation member.

Probe card for testing semiconductor devices

There is provided a method of manufacturing a probe card. A first passivation pattern for implementing a tip portion of an electrical inspection probe and a tip portion of a planarity sensing probe on a sacrificial substrate is formed, and an etching process using the first passivation pattern as an etch mask is performed to form a first trench in the sacrificial substrate. The first passivation pattern is removed, and a second passivation pattern having bar-type first openings exposing the first trench is formed. A conductive material is provided in the openings to form beam portions connected respectively to the tip portions of the inspection and sensing probes, thereby forming the inspection probe and the sensing probe. The beam portions of the inspection and sensing probes are bonded to a multi-layer circuit board. The sacrificial substrate is removed to expose the inspection probe and the sensing probe.

Growing community of inventors

Seoul, South Korea

Han-Moo Lee