Kingpak Technology Inc.

Han-Hsing Chen

Chung-Hsien Hsin

Hsiu-Wen Tu

Ming-Hui Chen

Ren-Long Kuo

Young-Houng Shiao

Tsao-Pin Chen

Chih-Cheng Hsu

Yi-Cheng Juan

A defect inspection method for a sensor package structure includes: using an image capture device to separately focus on and take pictures of at least three to-be-inspected regions of the sensor package structure along a height direction, so as to respectively obtain a defect image from one of the to-be-inspected regions, wherein the defect images are aligned with each other along the height direction and have different grayscale values; determining the defect image having a maximum grayscale value as a reference defect image, and defining any of the remaining defect images as a to-be-confirmed defect image; multiplying the maximum grayscale value by a predetermined grayscale ratio to obtain a predicted grayscale value, and confirming whether a difference between the to-be-confirmed and predicted grayscale values falls within an error range.

Defect inspection method for sensor package structure

An inspection apparatus includes a focus assistant loader and a camera assembly. The focus assistant loader includes a fetching member and a focus member connected to the fetching member. The focus member includes a plurality of focus portions respectively located at different levels. The camera assembly includes a plurality of cameras. The cameras may face the focus assistant loader and respectively focus on the focus portions. Thus, by using the cameras to focus on the focus portions, the inspection apparatus may find out tiny defects on a tested device held by the focus assistant loader. In addition, the present disclosure also discloses a focus assistant loader of an inspection apparatus and a method for inspecting a sensor package structure.

Method for inspecting sensor package structure, inspection apparatus, and focus assistant loader of inspection apparatus

The present invention discloses a wafer level image sensor packaging structure and a manufacturing method of the same. The manufacturing method includes the following steps: providing a silicon wafer, dicing the silicon wafer, providing a plurality of transparent lids, fabricating a plurality of semi-finished products, performing a packaging process, mounting solder balls, and cutting an encapsulant between the semi-finished products. The manufacturing method of the invention has the advantage of being straightforward, uncomplicated, and cost-saving. Thus, the wafer level image sensor package structure is lightweight, thin, and compact. To prevent the image sensor chip from cracking on impact during handling, the encapsulant will be arranged on the lateral sides of the semi-finished products during the packaging process.

Wafer level image sensor packaging structure and manufacturing method of the same

The present invention discloses a wafer level image sensor packaging structure and a manufacturing method for the same. The manufacturing method includes the following steps: providing a silicon wafer with image sensor chips, providing a plurality of transparent lids, allotting one said transparent lid on top of the corresponding image sensor chip, and carrying out a packaging process. The manufacturing method of the invention has the advantage of having a simpler process, lower cost, and higher production yield rate. The encapsulation compound arranges on the first surface of the image sensor chip and covers the circumference of the transparent lid to avoid the side light leakage as traditional chip scale package (CSP). Thus, the sensing performance of the wafer level image sensor packaging structure can be enhanced.

Wafer level image sensor packaging structure and manufacturing method for the same

This present invention discloses a manufacturing method and structure for a wafer level image sensor module with fixed focal length. The method includes the following steps. First, a silicon wafer comprising several image sensor chips having a photosensitive area and a lens module array wafer comprising several wafer level lens modules with fixed focal length are provided. Next, the image sensor chips and the wafer level lens modules are sorted in grades according to the different quality grades. According to the sorting results, each of the wafer level lens modules is assigned to be situated above the image sensor chip that has the same grade. At the same time, each of the wafer level lens modules is directed to face the photosensitive area of each image sensor chip. Finally, in the packaging process, the wafer level lens module is surrounded by an encapsulation material.

Manufacturing method and structure for wafer level image sensor module with fixed focal length

The present invention discloses a manufacturing method and structure of a wafer level image sensor module with package structure. The structure of the wafer level image sensor module with package structure includes a semi-finished product, a plurality of solder balls, and an encapsulant. The semi-finished product includes an image sensing chip and a wafer level lens assembly. The encapsulant is disposed on lateral sides of the image sensing chip and the wafer level lens assembly. Also, the manufacturing method includes the steps of: providing a silicon wafer, dicing the silicon wafer, providing a lens assembly wafer, fabricating a plurality of semi-finished products, performing a packaging process, mounting the solder balls, and cutting the encapsulant. Accordingly, the encapsulant encapsulates each of the semi-finished products by being disposed on the lateral sides thereof.

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Hsin-Chu Hsien, Taiwan

Han-Hsing Chen