Ulvac, Inc.

Kyocera Corporation

Chimei Innolux Corporation

Chi Mei Optoelectronics Corporation

Hajime Nakamura

Takaaki Shindou

Koji Ishino

Yukio Kikuchi

Mayako Matsuda

Satoru Ishibashi

Junya Kiyota

Atsushi Ota

Masasuke Matsudai

Mayako Taniguchi

Junichirou Tsutsui

Kazuya Saitou

Takaharu Koshimizu

Shigemitsu Sato

Hiroki Oozora

Michikazu Noguchi

This dummy substrate is for use in an inline reactive sputtering apparatus. The main unit thereof is made of a rectangular-plate-like frame structure in which an opening portion in a rectangular shape is formed in a metal plate in a similar shape. It is configured such that a contact portion of a carrier with the main unit is covered with the main unit. As a result, even while the sputtering apparatus is in operation, there is no possibility of the occurrence of undesirable situations such as glass cracking, making it possible to significantly increase the number of times the dummy substrate is used. Furthermore, the dummy substrate continues to cover the contact portion with the carrier. Thereby, it is possible to prevent deposition of a substance left in a sputter deposition chamber, especially a compound thin film, on the contact portion of the carrier with the substrate. Therefore, it is possible to prevent undesirable situations such as an abnormal discharge due to the deposition of the compound thin film. As a result of these, it is possible to start (activate) an apparatus that deposits a compound thin film by the sputtering method, retain and modify a deposition condition in the apparatus, and stop (deactivate) the apparatus in a shorter time, and more efficiently and at a lower cost than before.

Dummy substrate, and start method of, retention/modification method of deposition condition, and stop method of deposition apparatus using same

A conveyor and a deposition apparatus, and a maintenance method thereof are disclosed. The conveyor includes a frame; a lower support mechanism for supporting a carrier on which is longitudinally mounted a substrate and for transferring the carrier; and an upper support mechanism for supporting the carrier, in which the frame comprises a lower frame and an upper frame, and in which the lower support mechanism is provided on the lower frame and the upper support mechanism is provided on the upper frame, the upper frame and the lower frame being configured to be separately movable. Therefore, with the rotational movement of the upper frame, it is possible to arrange a cathode member in a space formed above the lower frame. This can make the spacing between the deposition treatment passage and the carrier transfer passage small. As a result, it is possible to make an inner court of the deposition apparatus narrow. Therefore, in the conveyor capable of transferring a carrier and in the deposition apparatus including the conveyor and further including a vacuum treatment apparatus and a transfer system, it is possible to make the installation area thereof small and narrow.

Conveyor and deposition apparatus, and maintenance method thereof

A supporting member, carrier and method of supporting are provided with a supporting member main body mounted to freely rotate. The supporting member main body is provided with a plurality of projections extending radially from a central rotation axis. Since the substrate is supported by abutment of the projections with an end of the substrate, the occurrence of cracking in the substrate can be prevented or the durability of the supporting member main body can be increased.

Supporting member and carrier, and method of supporting

To provide a vertical substrate transfer apparatus and a film-forming apparatus capable of, regardless of a carrying position of a substrate, subjecting either surface thereof to film-formation, and capable of supporting and carrying the substrate without interfering with a non-film-forming surface. A film-forming apparatus () according to the present invention includes a carrier () giving support so that either surface of a substrate (W) is processable, a first position changing section () changing a carrying position of the carrier (), and a carrying chamber () housing the carrier, whose position is changed therein and which carries the carrier to a film-forming chamber (). With the above construction, it becomes possible to subject either surface to film-forming processing regardless of the carrying position of the substrate (W). Further, it becomes possible to change a film-forming surface (Wa) in the course of carrying the substrate (W). Furthermore, it becomes possible to support the substrate (W) without causing the carrier () to interfere with a non-film-forming surface of the substrate (W).

Vertical substrate transfer apparatus and film-forming apparatus

An organic EL element has a capping layer formed on a cathode layer. The capping layer contains a pigment that absorbs light that has a wavelength that is different from a wavelength of the light emitted from a light emitting layer, and has a reflectance that is higher at interface in multi-layered structure than a reflectance of the light emitted from the light emitting layer. The capping layer prevents incident light from outside from returning to the outside of the organic EL element.

Image display device

According to the invention, when targets are sputtered, each of them moves with respect to a substrate; and therefore, the entire area of the substrate is opposed to the targets during sputtering, so that a film of homogeneous quality can be formed on the surface of the substrate. During the sputtering, not only the targets but also magnetic field forming devices are moved relative to the targets, and therefore, a large area of the targets can be sputtered. In addition, when the magnetic field forming devices are also moved with respect to the substrate, the region of the target which is highly sputtered, moves with respect to the substrate, so that the thickness distribution of the film formed on the substrate can be even more uniform.

Sputter source, sputtering device, and sputtering method

Growing community of inventors

Chigasaki, Japan

Hajime Nakamura