Skyworks Solutions, Inc.

Hailing Wang

Dylan Charles Bartle

Paul T DiCarlo

Hanching Fuh

David Scott Whitefield

Jerod F Mason

Yun Shi

Yu Zhu

Oleksiy Klimashov

The fabrication of field-effect transistor (FET) devices is described herein where the FET devices include one or more body contacts implemented between source, gate, drain (S/G/D) assemblies to improve the influence of a voltage applied at the body contact on the S/G/D assemblies. The FET devices can include source fingers and drain fingers interleaved with gate fingers. The source and drain fingers of a first S/G/D assembly can be electrically connected to the source and drain fingers of a second S/G/D assembly. The source fingers and the drain fingers can be arranged in alternating rows.

Field-effect transistors with interleaved finger configuration

Disclosed herein are switching or other active FET configurations that implement a branch design with one or more interior FETs of a main path coupled in parallel with one or more auxiliary FETs of an auxiliary path. Such designs include a circuit assembly for performing a switching function that includes a branch with a plurality of auxiliary FETs coupled in series and a main FET coupled in parallel with an interior FET of the plurality of auxiliary FETs. The body nodes of the FETs can be interconnected and/or connected to a body bias network. The body nodes of the FETs can be connected to body bias networks to enable individual body bias voltages to be used for individual or groups of FETs.

Main-auxiliary field-effect transistor configurations

Fabricating field-effect transistors with interleaved source and drain finger configuration

A method of fabricating a cascode amplifier including a common-source device and a common-gate device includes performing one or more of ion implantation of a well of the common-source device, ion implantation of a source extension and/or drain extension of the common-source device, or a halo ion implantation of the common-source device with one or more of a different ionic species, a different dosage, a different energy, or a different tilt angle than a corresponding one or more of ion implantation of a well of the common-gate device, ion implantation of a source and/or drain extension of the common-gate device, or a halo ion implantation of the common-gate device.

Cascode amplifier optimization

Switches with main-auxiliary field-effect transistor configurations

Main-auxiliary field-effect transistor configurations with an auxiliary stack and interior parallel transistors

Field-effect transistor (FET) devices are described herein that include an insulator layer, a plurality of active field-effect transistors (FETs) formed from an active silicon layer implemented over the insulator layer, a substrate layer implemented under the insulator layer, and proximity electrodes for a plurality of the FETs that are each configured to receive a voltage and to generate an electric field between the proximity electrode and a region generally underneath a corresponding active FET. FET devices can be stacked wherein one or more of the FET devices in the stack includes a proximity electrode. The proximity electrodes can be biased together, biased in groups, and/or biased individually.

Stacked field-effect transistors having proximity electrodes

The fabrication of field-effect transistor (FET) devices is described herein where the FET devices include one or more body contacts implemented between source, gate, drain (S/G/D) assemblies to improve the influence of a voltage applied at the body contact on the S/G/D assemblies. The FET devices can include source fingers and drain fingers interleaved with gate fingers. The source and drain fingers of a first S/G/D assembly can be electrically connected to the source and drain fingers of a second S/G/D assembly.

Fabricating field-effect transistors with body contacts between source, gate and drain assemblies

A cascode amplifier including a common-source device and a common-gate device formed utilizing different processing parameters to separately optimize performance of the common-source device and common-gate device.

Disclosed herein are switching or other active field-effect transistor (FET) configurations that implement independently controlled main-auxiliary branch designs. Such designs include a circuit assembly for performing a switching function that includes a branch with a plurality of main FET devices in parallel with a plurality of auxiliary FET devices. The circuit assembly can include a plurality of gate bias networks where each controls one or more of the main FET devices. The circuit assembly includes a second plurality of gate bias networks that each controls one or more of the auxiliary FET devices.

Independently controlled main-auxiliary branch configurations for radio frequency applications

Field-effect transistor (FET) devices are described herein that include one or more body contacts implemented near source, gate, drain (S/G/D) assemblies to improve the influence of a voltage applied at the body contact on the S/G/D assemblies. For example, body contacts can be implemented between S/G/D assemblies rather than on the ends of such assemblies. This can advantageously improve body contact influence on the S/G/D assemblies while maintaining a targeted size for the FET device.

Non-symmetric body contacts for field-effect transistors

Disclosed herein are switching or other active FET configurations that implement a branch design with one or more interior FETs of a main path coupled in parallel with one or more auxiliary FETs of an auxiliary path. Such designs include a circuit assembly for performing a switching function that includes a branch with a plurality of main FETs coupled in series and an auxiliary FET coupled in parallel with an interior FET of the plurality of main FETs. The body nodes of the FETs can be interconnected and/or connected to a body bias network. The body nodes of the FETs can be connected to body bias networks to enable individual body bias voltages to be used for individual or groups of FETs.

Main-auxiliary field-effect transistor configurations with interior parallel transistors

Disclosed herein are switching or other active FET configurations that implement a main-auxiliary branch design. Such designs include a circuit assembly for performing a switching function that includes a branch including a main path in parallel with a first auxiliary path and the main path in series with a second auxiliary path. The circuit assembly also includes a first gate bias network connected to the main path. The circuit assembly also includes a second gate bias network connected to the first auxiliary path. The circuit assembly also includes a third gate bias network connected to the second auxiliary path, the second gate bias network and the third gate bias network configured to improve linearity of the switching function.

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Acton, MA, United States of America

Hailing Wang