Samsung Electronics Co., Ltd.

Hae-Joong Park

Kwang-Nam Kim

Jong-Woo Sun

Jung-Pyo Hong

Jeongryul Kim

Sung-Wook Jung

Sang-Rok Oh

Byeong-Hee Kim

Nam-Young Cho

Dong-Jun Shin

A semiconductor manufacturing apparatus includes a loadlock module including a loadlock chamber in which a substrate container is received, wherein the loadlock module is configured to switch an internal pressure of the loadlock chamber between atmospheric pressure and a vacuum; and a transfer module configured to transfer a substrate between the substrate container received in the loadlock chamber and a process module for performing a semiconductor manufacturing process on the substrate, wherein the loadlock module includes a purge gas supply unit configured to supply a purge gas into the substrate container through a gas supply line connected to the substrate container; and an exhaust unit configured to discharge a gas in the substrate container through an exhaust line connected to the substrate container.

Loadlock module and semiconductor manufacturing apparatus including the same

Example embodiments provide a method of de-chucking a wafer by alternating between using a direct voltage and an alternating voltage, and an apparatus for fabricating a semiconductor device using the same. The method of de-chucking a wafer comprises interrupting a chucking voltage applied to an electrostatic chuck, applying a first de-chucking voltage to the electrostatic chuck, and applying a second de-chucking voltage to the electrostatic chuck.

Method of de-chucking wafer using direct voltage and alternating voltage, and apparatus for fabricating semiconductor device using the same

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Yongin-si, South Korea

Hae-Joong Park