Intel Corporation

Guoxing Duan

John David Hopkins

David A Daycock

Qian Tao

Christopher J Larsen

Purnima Narayanan

Meng-Wei Kuo

Barbara L Casey

A 3D NAND storage device includes a plurality of layers containing doped semiconductor material interleaved with a plurality of layers of dielectric material. Each of the pillars forming the 3D NAND storage device includes a plurality of memory cells and a drain-end select gate (SGD). The pillars are separated by a hollow channel in which a plurality of film layers, including at least a lower film layer and an upper film layer have been deposited. The systems and methods described herein remove at least the upper film layer proximate the SGD while maintaining the film layers proximate the memory cells. Such an arrangement beneficially permits tailoring the film layers proximate the SGD prior to depositing the channel film layer in the hollow channel. The systems and methods described herein permit the deposition of a continuous channel film layer proximate both the memory cells and the SGD.

3D NAND with integral drain-end select gate (SGD)

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Boise, ID, United States of America

Guoxing Duan