Mrs Technology, Inc.

Azores Corporation

Griffith L Resor, Iii

Robert A McEachern

Walter H Worth

Elvino M Da Silveira

Steven D Gardner

William C Schneider

A machine and method for high speed production of circuit patterns on silicon wafers or similar substrates may be used for applications including printing Integrated Circuit (IC) packaging patterns onto wafers prior to separating IC chips. Projection camera(s) simultaneously project image(s) onto substrate(s) carried on an X, Y, &#x3b8; stage. The projection camera(s) may include independent alignment systems, light sources, and control of focus, image placement, image size, and dose. In one embodiment, each camera includes a 6-axis reticle chuck that moves a reticle to correct image-to-substrate overlay errors. In-stage metrology sensors and machine software establish and maintain the correct relationship among the machine's coordinate systems. Thus, two or more projection cameras can print simultaneously even when substrates are slightly misplaced on the X, Y, &#x3b8; stage.

High speed lithography machine and method

Apparatus for projecting multiple images from a pair of reticles (117) to a photo-sensitive coated substrate (1) to produce large scale electronic devices (2). A pair of parallel and proximate optical systems (29) are used, the optical systems being positioned to project in the z-direction upon a movable stage (11) subject to controlled motion (159, 169) in the x- and y-directions. The apparatus includes means (225) for determining the coordinates of motion of the stage relative to images projected from the reticles, means for using the determined positions to establish a stage transfer function for the apparatus relative to various positions of stage, and means (130) for applying the transfer function to adjust the relative positions of the reticles (117) and substrate (1) for accurate image projection, and for thereafter projecting an image upon the substrate. The stage is then stepped to a position to permit projection of an abutting image, and the transfer function is used to adjust the relative positions of the reticles (117) and substrate (1) for accurate image projection for projecting the abutting image upon the substrate (1). The steps are repeated until sufficient images have been projected upon the substrate to make up one integrated layer of a flat panel display or other large scale electronic device. After treating the photosensitive layer, subsequent layers are produced in a similar manner.

Apparatus and method for making large area electronic devices, such as

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Acton, MA, United States of America

Griffith L Resor, Iii