Applied Materials, Inc.

Gregory Siu

Sanjeev Baluja

Deenesh Padhi

Ren-Guan Duan

Ajit Balakrishna

Praket Prakash Jha

Kalyanjit Ghosh

Mayur G Kulkarni

Wei Min Chan

Lei Guo

Embodiments disclosed herein generally relate to systems and methods to prevent free radical damage to sensitive components in a process chamber and optimizing flow profiles. The processing chamber utilizes a cover substrate on lift pins and an inert bottom purge flow to shield the substrate support from halogen reactants. During a clean process, the cover substrate and the purge flow restricts halogen reactants from contacting the substrate support. The method of cleaning includes placing a cover substrate on a plurality of lift pins that extend through a substrate support in a processing chamber, raising the cover substrate via the lift pins to expose a space between the cover substrate and the substrate support, supplying a halogen containing gas into the processing chamber, supplying a second gas through an opening in the processing chamber, and flowing the second gas through the space between the cover substrate and the substrate support.

Method and system for high temperature clean

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Saratoga, CA, United States of America

Gregory Siu