Mapper Lithography IP B.v.

Asml Netherlands B.v.

Godefridus Cornelius Antonius Couweleers

Niels Vergeer

Guido De Boer

Cor Verburg

Laurens Vincent Plandsoen

Thomas Adriaan Ooms

Thomas Adrian Ooms

Cornelis Verburg

The invention relates to a differential interferometer module adapted for measuring a direction of displacement between a reference mirror and a measurement mirror. In an embodiment the differential interferometer module is adapted for emitting three reference beams towards a first mirror and three measurement beams towards a second mirror for determining a displacement between said first and second mirror. In a preferred embodiment the same module is adapted for measuring a relative rotation around two perpendicular axes as well. The present invention further relates to a lithography system comprising such a interferometer module and a method for measuring such a displacement and rotations.

Interferometer module

The invention relates to a lithography system comprising an optical column, a moveable target carrier for displacing a target such as a wafer, and a differential interferometer module, wherein the interferometer module is adapted for emitting three reference beams towards a first mirror and three measurement beams towards a second mirror for determining a displacement between said first and second mirror. In a preferred embodiment the same module is adapted for measuring a relative rotation around two perpendicular axes as well. The present invention further relates to an interferometer module and method for measuring such a displacement and rotations.

Lithography system with differential interferometer module

The invention relates to a multi-axis differential interferometer () for measuring a displacement and/or rotation between a first reflective surface () and a second reflective surface (), wherein said measuring is carried out using at least two pairs of beams, wherein each pair is formed by a measurement beam (Mb) to be emitted onto a first one () of said reflective surfaces, and a reference beam (Rb) to be emitted onto another one () of said reflective surfaces, said interferometer () comprising: a first optical module () and a second optical module (), wherein each optical module () is configured for receiving a respective coherent beam and for creating one of said pairs therefrom. The invention further relates to a lithography system comprising such an interferometer and to a method for assembling such a multi-axis differential interferometer.

Multi-axis differential interferometer

The invention relates to a lithography system for processing a target, such as a wafer. The lithography system comprises a beam source arranged for providing a patterning beam, a final projection system arranged for projecting a pattern on the target surface, a chuck arranged for supporting the target and a mark position system connected to the final projection system and arranged for detecting a position mark on a surface.

Lithography system for processing a target, such as a wafer, and a method for operating a lithography system for processing a target, such as a wafer

The invention relates to a lithography system for processing a target, wherein the lithography system comprises a final projection system arranged for projecting a pattern on the target surface. The lithography system comprises a mark position detection system arranged for detecting a position of a position mark on the target surface. The mark position detection system comprises an optical element arranged for projecting a light beam on the target surface and a light detector arranged for detecting a reflected light beam. The optical element may be positioned adjacent to the final projection system and the light detector may be positioned inside a frame.

Lithography system for processing at least a part of a target

The invention relates to alignment of an interferometer module for use in an exposure tool. An alignment method is provided for aligning an interferometer to the tool while outside of the too. Furthermore, the invention provides a dual interferometer module, an alignment frame use in the alignment method, and an exposure tool provided with first mounting surfaces for cooperative engagement with second mounting surfaces of an interferometer module.

Alignment of an interferometer module for use in an exposure tool

The invention relates to a lithography system for processing a target, such as a wafer and a substrate for use in such a lithography system. The lithography system comprises a beam source arranged for providing a patterning beam, a final projection system arranged for projecting a pattern on the target surface, a chuck arranged for supporting the target and a mark position system arranged for detecting a position mark on a surface.

Lithography system for processing a target, such as a wafer, a method for operating a lithography system for processing a target, such as a wafer and a substrate for use in such a lithography system

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Delft, Netherlands

Godefridus Cornelius Antonius Couweleers