Intermolecular, Inc.

Glen Eric Egami

Rajesh Kelekar

Aaron T Francis

Satbir Kahlon

Chucks for mounting and retaining semiconductor wafers during processing are described, particularly suited for wafer processing involving total immersion of the wafer-chuck structure in a liquid. Chuck structures are disclosed for preventing or hindering processing chemicals from contacting and contaminating large portions of the underside of the wafer undergoing processing, limiting such chemical contact to readily cleaned, relatively small annular regions on the periphery of the wafer. Embodiments include structures with supplemental gas flows on the underside of the wafer as well as the creation of gas/liquid meniscusci to prevent chemical penetration of the wafer's underside. Methods of processing semiconductor wafers employing such chucks are also described.

Chuck for mounting a semiconductor wafer for liquid immersion processing

In one embodiment, a cleaning chamber is provided. The cleaning chamber has a base portion housing a first chuck, a top portion housing a plurality of cups, and a middle portion functioning as a lid for the base portion and a second chuck for the top portion. A rail couples the top portion and the middle portion, wherein the top portion is rigidly mounted to the rail, while the middle portion is slidably mounted to the rail. A support frame is rigidly mounted to the base portion, the support frame being pivotably affixed to the rail, wherein the rail maintains a vertical alignment between the top portion and the middle portion as the rail pivots.

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San Jose, CA, United States of America

Glen Eric Egami