Infineon Technologies Ag

Soitec

Siemens Aktiengesellschaft

Infineon Technologies Richmond, LP

Qimonda Ag

Infineon Technologies North America Corp.

Gerhard Enders

Peter Voigt

Michael Bernhard Sommer

Dietrich Widmann

Walter Hartner

Lothar Risch

Nicolas Nagel

Rainer Bruchhaus

Thomas Mikolajick

Thomas Schulz

Dietrich Bonart

Matthias Kr&ouml;nke

Michael R&ouml;hner

Franz Hofmann

Helmut Schneider

Richard Ferrant

Carlos Mazure

Matthias Ilg

Wolfgang Hoenlein

Bjoern Fischer

Peter Baars

Roland Thewes

Wolfgang Roesner

Hans-Peter Moll

Joerg Vollrath

Volker Weinrich

Martin Popp

Klaus Muemmler

Stefan Jakschik

Werner Graf

Peter Lahnor

Igor Kasko

Bernd Hintze

Lars Heineck

Arnd Scholz

Willy Beinvogl

Andreas Spitzer

Matthias Krönke

Andrei Josiek

Michael Röhner

Gouri Sankar Kar

Ernst-Guenter Mohr

Hofmann Franz

This disclosure relates to an eDRAM memory element comprising a first storage node, a bitline node for accessing the value stored in the storage node, and a select transistor, controlling access from the bitline node to the storage node, wherein the select transistor has a front gate and a back gate.

Back gate in select transistor for eDRAM

The invention relates to a sense amplifier for sensing and amplifying data stored in a memory cell, the sense amplifier being connected between a bit line (BL) and a reference bit line complementary (/BL) to the first bit line and comprising: a sense circuit (SC) capable of providing an output indicative of the data stored in the memory cell; and a precharge and decode circuit (PDC) comprising a pair of dual gate transistors (T, T) for precharging the first and second bit lines during a precharge operation and for transferring the output provided by the sense circuit to a data line (LIO,/LIO) during a read operation.

Sense amplifier with dual gate precharge and decode transistors

A semiconductor memory having bit lines and wordlines crossing each other, a memory cell array formed by memory cells arranged in rows and columns on crossover points of the bit lines and wordlines, and sense amplifier banks arranged on opposite sides of the memory cell array. Each sense amplifier bank has staggered sense amplifiers connected to a bit line according to an interleaved arrangement whereby bit lines alternate in the direction of the wordlines between bit lines coupled to different sense amplifiers. This results in interconnect spaces parallel to the bit lines. Also, each sense amplifier bank includes a local column decoder for selecting a sense amplifier and which is staggered with the sense amplifiers and coupled to the sense amplifier by an output line running in an available interconnect space parallel to the bit lines.

Semiconductor memory having staggered sense amplifiers associated with a local column decoder

The present invention relates to a method for the manufacture of a semiconductor device by providing a first substrate; providing a doped layer in a surface region of the first substrate; providing a buried oxide layer on the doped layer; providing a semiconductor layer on the buried oxide layer to obtain a semiconductor-on-insulator (SeOI) wafer; removing the buried oxide layer and the semiconductor layer from a first region of the SeOI wafer while maintaining the buried oxide layer and the semiconductor layer in a second region of the SeOI water; providing an upper transistor in the second region by forming a back gate in or by the doped layer; and providing a lower transistor in the first region by forming source and drain regions in or by the doped layer.

Fully depleted SOI device with buried doped layer

One embodiment relates to an integrated circuit formed on a semiconductor body having interconnect between source/drain regions of a first and second transistor. The interconnect includes a metal body arranged underneath the surface of the semiconductor body. A contact element establishes electrical contact between the metal body and the source/drain regions of the first and second transistor. The contact element extends along a connecting path between the source/drain regions of the first and second transistors. Other methods, devices, and systems are also disclosed.

Interconnect structure for semiconductor devices

The invention relates to a semiconductor memory, particularly a DRAM, in which the memory cells in each case have a trench capacitor arranged in a lower area of a trench hole and a vertical selection transistor which is formed adjoining an upper area of the trench hole and which connects an inner electrode of the trench capacitor to a bit line, a conductive channel being capable of being formed in dependence on the potential of a word line in the channel area, the channel area completely enclosing the trench hole in its upper area, and the associated word line at least partially enclosing the channel area.

DRAM memory with vertically arranged selection transistors

Memory cell having a trench capacitor that is constructed in a lower region of a substantially perpendicular trench hole, and which comprises an inner and an outer electrode, a dielectric layer being arranged between the inner and the outer electrodes, a vertical selection transistor that has a substantially perpendicular channel region, which is constructed adjacent to an upper region of the trench hole and which connects the inner electrode of the trench capacitor to a bit line, it being possible to construct a conductive channel as a function of the potential of a word line in the channel region, the channel region partially enclosing the trench hole in its upper region, and the associated work line at least partially surrounding the channel region.

DRAM memory having vertically arranged selection transistors

A buried strap contact between a trench capacitor of a memory cell and the subsequently formed selection transistor of the memory cell is fabricated such that the inner capacitor electrode layer is etched back in the trench of the trench capacitor and the uncovered insulator layer is then removed at the trench wall in order to define the region of the buried strap contact area. A liner layer is subsequently deposited in order to cover the inner capacitor electrode layer in the trench and the uncovered trench wall and thus to form a barrier layer. A spacer layer with the material of the inner electrode layer is then formed on the liner layer at the trench wall. Finally, the uncovered liner layer is removed above the inner electrode layer and the trench is filled with the material of the inner electrode layer in order to fabricate the buried strap contact.

Buried strap contact for a storage capacitor and method for fabricating it

A method for processing a substrate to produce a structure, for example an insulating trench, uses a lithographic mask exposure process. Conventionally, the optical resolution limit prescribes the minimum width for any structure that can be produced. The method produces structures having a width less than the optical resolution limit on raised regions of the semiconductor substrate. Use is made of spacer technology, before the application of which the method first involves the local level ratios on the semiconductor substrate being reversed by trench etching, trench filling and subsequent back-etching of the trench interspace. The method allows insulating trenches of any narrow width between zero and the respective optical resolution limit to be produced on locally raised surface regions of the substrate.

Method for processing a substrate to form a structure

A method for fabricating a gate structure of a FET, having: (a) deposition and patterning of a sacrificial layer sequence on a semiconductor substrate and uncovering of a gate section; (b) implantation of a channel doping into the gate section; (c) deposition and patterning of spacers at the sidewalls of the sacrificial layer sequence with the formation of a gate section that is not covered by the spacers; (d) introduction of a mask material into the gate section that is not covered by the spacers; (e) removal of the spacers selectively with respect to the sacrificial layer sequence and mask material); (f) implantation of a halo doping in regions uncovered by the removed spacers; (g) removal of the mask material; (h) formation of a gate on the gate section; and (j) removal of the sacrificial layer sequence selectively with respect to the gate.

Method for fabricating a gate structure of a FET and gate structure of a FET

A method for fabricating a semiconductor gate structure including depositing at least one sacrificial layer on a semiconductor substrate; patterning the at least one sacrificial layer to form at least one cutout in the at least one sacrificial layer for uncovering the semiconductor substrate; forming a sidewall spacer over the sidewalls of the at least one sacrificial layer in the at least one cutout; forming a gate dielectric on the semiconductor substrate in the cutout; providing a gate electrode in the at least one cutout in the at lest one sacrificial layer; and removing the at least one sacrificial layer for the uncovering the gate electrode surrounded by the sidewall spacer. A semiconductor device is also provided.

Semiconductor gate structure and method for fabricating a semiconductor gate structure

The present invention relates to a method for producing a vertical transistor, and to a vertical transistor. A sacrificial gate oxide and a sacrificial gate electrode are used during the production of the vertical transistor to makes it possible to considerably reduce or entirely avoid negative effects that normally result from the production of insulation structures between the vertical transistors. In particular, broadening of the gate oxide at the edge of the gate electrode can be prevented, and the edge of the gate electrode can be influenced deliberately. This allows vertical transistors to be produced having a current/voltage characteristic that can be adjusted specifically. In particular, vertical transistors can be produced having a pronounced corner effect.

Vertical transistor, and a method for producing a vertical transistor

A field-effect transistor includes a semiconductor substrate, a source region formed in the semiconductor substrate, a drain region formed in the semiconductor substrate, a channel region formed in the semiconductor substrate, wherein the source region is connected to a source terminal electrode and the drain region is connected to a drain terminal electrode, wherein the channel region comprises a first narrow width channel region and a second narrow width channel region connected in parallel regarding the source terminal electrode and the drain terminal electrode, and wherein the first narrow width channel region and/or the second narrow width channel region comprise lateral edges narrowing the width of the narrow width channel region is such a way that a channel formation in the narrow width channel region is influenced by a mutually influencing effect of the lateral edges, and a gate electrode arranged above the first and second narrow width channel regions.

Field-effect transistor

An integrated semiconductor memory is disclosed having selection transistors which can be formed at a respective ridge. The ridge can be arranged on an insulation layer. In the ridge the first source/drain region can be formed at one lateral end of the ridge and the second source/drain region can be formed at another lateral end of the ridge. The longitudinal sides of the ridge and a top side of the ridge can be covered with a layer stack including a gate dielectric and a gate electrode. High write-read currents can be achieved in the on state of the selection transistors and leakage currents occurring in the off state can be reduced.

Integrated semiconductor memory with a selection transistor formed at a ridge

The memory cell according to the invention has a vertical selection transistor, via whose channel region the inner electrode of the trench capacitor can be connected to a bit line. The large extent of the channel region in the bit line direction means that the trench capacitor can be rapidly charged and read. The channel region is led to the bit line through an associated word line, which completely or partially encloses the channel region. A conductive channel can be formed within the channel region depending on the potential of the word line.

DRAM memory cell and memory cell array with fast read/write access

Growing community of inventors

Olching, Germany

Gerhard Enders