Leica Microsystems Semiconductor Gmbh

Muetec Automatisierte Mikroskopie Und Messtecknik Gmbh

Muetec Automatisierta Mikroskopie Und Messtechnik Gmbh

Gerd Scheuring

Wolfgang Vollrath

Hans-Juergen Brueck

Hans-Jürgen Brueck

Frank Hillmann

The invention relates to a method for optical measurement of an OPC structure (), having a pre-determined structure () on a photo-mask, in order to determine a measurement of the structure in at least one direction, whereby, firstly, a region () is determined on the photo-mask, which comprises the OPC structure () to be measured. The intensity of the determined region () is then scanned in a first direction and the region in which the intensity passes a threshold is determined for each scan. The maximum separation between an edge () of the structure () and an edge () of the corresponding OPC structure () is determined, based on the difference of the determined regions.

Method for an automatic optical measuring of an OPC structure

An apparatus for measuring feature widths on masksfor the semiconductor industry is disclosed. The apparatus encompasses a carrier platethat is retained in vibrationally decoupled fashion in a base frame; a scanning stage, arranged on the carrier plate, that carries a maskto be measured, the maskdefining a surface; and an objectivearranged opposite the mask. A liquidis provided between the objectiveand the surfaceof the mask

Apparatus for measuring feature widths on masks for the semiconductor industry

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Munich, Germany

Gerd Scheuring