Kabushiki Kaisha Toshiba

Ebara Corporation

Gen Toyota

Hiroyuki Yano

Atsushi Shigeta

Tetsuji Togawa

Toshio Watanabe

Yoshikuni Tateyama

Kenji Iwade

Kenya Ito

Takeo Kubota

Kenji Yamaguchi

Tamami Takahashi

Masayuki Nakanishi

Kunio Oishi

Daisaku Fukuoka

A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to be polished and of effectively cooling a substrate holding part of the substrate holding mechanism, and also capable of effectively preventing a polishing solution and polishing dust from adhering to an outer peripheral portion of the substrate holding part and drying thereon. The substrate holding mechanism has a mounting flange, a support memberand a retainer ring. A substrate to be polished is held on a lower side of the support member surrounded by the retainer ring, and the substrate is pressed against a polishing surface of a polishing table. The mounting flange is provided with a flow passage contiguous with at least the retainer ring. A temperature-controlled gas is supplied through the flow passage to cool the mounting flange, the support member and the retainer ring. The retainer ring is provided with a plurality of through-holes communicating with the flow passage to spray the gas flowing through the flow passage onto the polishing surface of the polishing table.

Substrate holding mechanism, substrate polishing apparatus and substrate polishing method

A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrateby a motor, polishing a first surface of a peripheral portion of the substrateby pressing a polishing surface of a polishing mechanismagainst the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.

Substrate processing method and substrate processing apparatus

A polishing apparatus has a polishing tape (), a supply reel () for supplying the polishing tape () to a contact portion () at which the polishing tape () is brought into contact with a notch portion () of a substrate (), and a take-up reel () for winding up the polishing tape () from the contact portion (). The polishing apparatus also has a first guide portion () having as guide surface () for supplying the polishing tape () directly to the contact portion (), and a second guide portion () having a guide surface for supplying the polishing tape () tot the take-up reel (). The guide surface () of the first guide portion () and/or the guide surface of the second guide portion () has a shape corresponding to a shape of the notch portion () of the substrate ().

Polishing apparatus and polishing method

A method of processing a substrate is disclosed, wherein a sidewall surface of a notch portion formed in a circumferential portion of a substrate to be processed is polished by using a cylindrical polishing head rotatable with an axis as a rotational center.

Method of processing a substrate

There is disclosed a method of processing a substrate, which comprises applying a surfactant or a water soluble polymer agent onto a surface of a substrate to be processed, and sliding a circumferential portion of the substrate and a polishing member against each other to polish the circumferential portion of the substrate.

A substrate processing apparatus polishes a to-be-polished portion of a semiconductor substrate with a polishing tape. Part of the polishing tape is heated in advance. Part of the polishing tape is deformed conforming to a shape of the to-be-polished portion. Part of the deformed polishing tape is brought into contact with the to-be-polished portion of the substrate. The substrate and polishing tape are moved relative to each other.

Growing community of inventors

Yokohama, Japan

Gen Toyota