Intel Corporation

Splunk Inc.

Gaurav Chawla

Joshua Heppner

Vijaykumar Krithivasan

Jeffory L Smalley

David J Llapitan

Zhichao Zhang

Donald Tiendung Tran

Rajasekaran Swaminathan

Kemal Aygun

Srikant Nekkanty

Kuang C Liu

Michael Garcia

Jeffrey Lee

Adel A Elsherbini

Shawna M Liff

Telesphor Kamgaing

Sasha N Oster

Tao Wu

Gregorio R Murtagian

Glen Patrick Gordon

Mehul Goyal

Sarah M Canny

Sumeet Rohatgi

Hao Zhan

Dhanya Athreya

Sanka Ganesan

Russell S Aoki

Ram S Viswanath

Hong Xie

Jonathan W Thibado

Susan F Smith

Mani Prakash

Neal E Ulen

Sanjeev Raghavendra Kulkarni

Feroz Mohammad

Karumbu Meyyappan

Karthikeyan Ramasamy

Boyang Peng

Matteo Merli

Sanish N Mahadik

Ivan Kelly

Li Sun

Aditya Kamble

Tyler Bakke

Rahul Merulinath

Ryan Flynn

Nishanth Reddy Pinnapareddy

Krishnan Ananthesweran

Tejinder Pal Aulakh

Joshua D Heppner

A deployment orchestrator is provided that manages package deployments at different hierarchical levels. Each hierarchical level is associated with a particular type of resource object. The deployment orchestrator creates different of resource objects, each associated with a different hierarchical level and updates instances of the different resource objects based on information related to a package that is to be deployed. The deployment orchestrator performs processing associated with deploying the package at the hierarchical level based on information stored in the instances of the resource objects associated with the hierarchical level e.g., information related to a package that is to be deployed.

Deployment orchestrator in a cloud based service for customer enterprises

A process for facilitating autoscaling in a stateful system is described herein. In embodiments, a set of metrics associated with a set of components of a stateful service is obtained. The set of metrics may generally indicate a utilization or a load of each of the components of the set of components (e.g., message managers and/or data stores). Thereafter, it is determined to initiate a scaling event at the stateful service in association with the set of components of the stateful service based on at least a portion of the set of metrics attaining a metric threshold indicating a threshold value for determining whether to scale stateful service components. A scaling request can then be provided to the stateful service to initiate the scaling event at the stateful service in association with the set of components of the stateful service.

Autoscaling in a stateful system

A control plane system can be used to manage or generated components in a shared computing resource environment. To generate a modified components, the control plane system can receive receiving configurations of a component. The configurations can include software versions and/or parameters for the component. Using the configurations, the control plane system can generate an image of a modified component, and communicate the image to a master node in the shared computing resource environment. The master node can provides one or more instances of the modified component for use based on the received image.

Generating a modified component for a data intake and query system using an isolated execution environment image

Microelectronic package communication is described using radio interfaces connected through wiring. One example includes a system board, an integrated circuit chip, and a package substrate mounted to the system board to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components. A radio on the package substrate is coupled to the integrated circuit chip to modulate the data onto a carrier and to transmit the modulated data. A radio on the system board receives the transmitted modulated data and demodulates the received data, and a cable interface is coupled to the system board radio to couple the received demodulated data to a cable.

Microelectronic package communication using radio interfaces connected through wiring

A land grid array (LGA) land pad having reduced capacitance is disclosed. The conductive portion of a land pad that overlaps a parallel ground plane within the substrate is reduced by one or more non-conductive voids though the thickness of the conductive portion of the land pad. The voids may allow the contact area of the land pad, as defined by the perimeter of the land pad, to remain the same while reducing the conductive portion that overlaps the parallel ground plane. Capacitance between the land pad and the parallel ground plane is reduced by an amount proportional to the reduction in overlapping conductive area.

Reduced capacitance land pad

Embodiments of the present disclosure are directed towards socket contact techniques and configurations. In one embodiment, an apparatus may include a socket substrate having a first side and a second side disposed opposite to the first side, an opening formed through the socket substrate, an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and surfaces of the socket substrate in the opening are plated with a metal. Other embodiments may be described and/or claimed.

Socket contact techniques and configurations

An apparatus comprises a cable connector including: a first connector body portion including a first plurality of electrical contacts arranged to contact electrical contacts of a first surface of an edge connector substrate; a second connector body portion separate from the first connector body portion and including a second plurality of electrical contacts arranged to oppose the first plurality of electrical contacts of the first connector body portion and to contact electrical contacts of a second surface of the edge connector substrate, wherein the first and second plurality of electrical contacts are electrically coupled to one or more cables; and a joining mechanism configured to join the first connector body portion and the second connector body portion together and to apply a bias force to the edge connector substrate when the edge connector substrate is arranged between the first connector body portion and the second connector body portion.

Universal linear edge connector

Embodiments of the present disclosure are directed towards a socket loading element and associated techniques and configurations. In one embodiment, an apparatus may include a loading element configured to transfer a compressive load from a heat spreader to a socket assembly, wherein the loading element is configured to form a perimeter around a die when the loading element is coupled with an interposer disposed between the die and the socket assembly and wherein the loading element includes an opening configured to accommodate the die. Other embodiments may be described and/or claimed.

Socket loading element and associated techniques and configurations

A cable connector that includes a substrate having a plurality of conductive pads and at least one grounding pad. The cable connector further includes twin axial cable that includes a first conductor and second conductor, a first insulator that surrounds the first conductor, and a second insulator that surrounds the second conductor. The twin axial cable further includes a ground shield that surrounds the first and second insulator. The first conductor is electrically connected to one conductive pad and the second conductor is electrically connected to another of the conductive pads. The ground shield is electrically connected to the grounding pad. A shielding structure is mounted to the substrate and is electrically connected to the grounding pad. The shielding structure includes a cap and a plurality of sidewalls extending from the cap to the substrate. The twin axial cable is positioned between the side walls.

Cable connector

Embodiments of the present disclosure are directed toward techniques and configurations associated with a package load assembly. In one embodiment, a package load assembly may include a frame configured to form a perimeter around a die area of a package substrate having a first surface configured to be coupled with a surface of the package substrate and a second surface disposed opposite to the first surface. The frame may include deformable members disposed on the second surface, which may be configured to be coupled with a base of a heat sink to distribute force applied between the heat sink and the package substrate, via the frame, and may deform under application of the force, which may allow the base of the heat sink to contact a surface of an integrated heat spreader within the die area of the package substrate.

Techniques and configurations associated with a package load assembly

Some forms relate to an electronic assembly that includes a plurality of electronic package. The electronic assembly includes a frame and a first electronic package mounted on the frame. The first electronic package includes a first pin grid array. The electronic assembly further includes a second electronic package mounted on the frame. The second electronic package includes a second pin grid array. The electronic assembly further includes an actuation mechanism on the frame. The actuation mechanism is configured to move the first electronic package and the second electronic package relative to the frame during operation of the actuation mechanism.

Electronic assembly that includes a plurality of electronic packages

A connector for a multi-array bottom side array is described that uses a spring bias. In one example, a connector includes a connector housing, the connector housing having a bottom surface, and a plurality of resilient connectors opposite the bottom surface to electrically connect to a corresponding plurality of pads of an integrated circuit package, a cable connector to electrically connect the resilient connectors to a cable, a base plate having a bottom surface to press against a circuit board, and a top surface opposite the bottom surface, and plurality of spring members coupled between the base plate and the connector bottom surface to press the base plate bottom surface against the system board and to press the connector housing connectors against the package.

Multi-array bottom-side connector using spring bias

Growing community of inventors

Tempe, AZ, United States of America

Gaurav Chawla