Rohm & Haas Electronic Materials LLC

Gary Hamm

Wade W Sonnenberg

Erik Reddington

John P Cahalen

Mark J Kapeckas

Leon Barstad

Carl J Colangelo

George R Allardyce

David L Jacques

Jason Reese

Thomas Buckley

Raymond Cruz

Narsmoul Karaya

Katie Price

Trevor Goodrich

Jason A Reese

David J Jacques

Copper electroplating methods provide low internal stress copper deposits. Concentrations of accelerators in the copper electroplating bath vary as a function of the plating current density and the low internal stress copper deposit is observed as a matt copper deposit.

Low internal stress copper electroplating method

Semiconductors are electrochemically etched in solutions containing sources of bifluoride and nickel ions. The electrochemical etching may form pores in the surface of the semiconductor in the nanometer range. The etched semiconductor is then nickel plated.

Electrochemical etching of semiconductors

Silicon containing substrates are coated with nickel. The nickel is coated with a protective layer and the combination is heated to a sufficient temperature to form nickel silicide. The nickel silicide formation may be performed in oxygen containing environments.

Enhanced method of forming nickel silicides

Methods of light induced plating of nickel onto semiconductors are disclosed. The methods involve applying light at an initial intensity for a limited amount of time followed by reducing the intensity of the light for the remainder of the plating period to deposit nickel on a semiconductor.

Method of light induced plating on semiconductors

Methods of inhibiting background plating on semiconductor substrates using oxidizing agents are disclosed.

Method of inhibiting background plating

Analytical methods are disclosed for determining the quantity of brightener and leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. The methods improve the reproducibility of measuring brighteners and levelers in electroplating baths.

Bath analysis

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Billerica, MA, United States of America

Gary Hamm