Semiconductor Manufacturing International (shanghai) Corporation

Semiconductor Manufacturing International (beijing) Corporation

Smic Advanced Technology Research & Development (shanghai) Corp.

Imec International

Gang Mao

Yang Liu

Shaofeng Yu

Hai Zhao

Jian Cui

YongMeng Lee

Cheng-Jui Yang

Wen Yue Zheng

The present disclosure relates to the technical field of semiconductor processes, and discloses a semiconductor device and a manufacturing method therefor. The semiconductor device includes a substrate; two fins located on the substrate and extending along a first direction; an isolation material layer surrounding the fins, comprising a first isolation regions located at an end region between the two fins along the first direction, and a second isolation region located at sides of the fins along a second direction that is different from the first direction, wherein an upper surface of the first isolation region substantially align with an upper surfaces of the fins, and an upper surface of the second isolation region is lower than the upper surface of the fins; and a first insulating layer on the first isolation region.

Method for manufacturing a semiconductor device having a fin located on a substrate

The present disclosure provides fin field-effect transistors and fabrication methods thereof. An exemplary fabrication process includes providing a substrate having a first region and a second region; forming first fins in the first region and second fins in the second region; forming a liner oxide layer on side surfaces of the first fins, the second fins and a surface of the substrate; forming an insulating barrier layer on the liner oxide layer in the first region; forming a precursor material layer on the insulating barrier layer in the first region and on the liner oxide layer in the second region; performing a curing annealing process to convert the precursor material into an insulation layer; and removing a top portion of the insulation layer to form an isolating layer and removing portions of the liner oxide layer, the insulating barrier layer, the first oxide layer and the second oxide layer.

Fin field-effect transistor and fabrication method thereof

A method of manufacturing a semiconductor device includes forming a PMOS region and an NMOS region in a semiconductor substrate, forming dummy gate structures in the PMOS and NMOS regions, and forming a gate hard mask layer overlying top portions and sidewalls of the dummy gate structures. The method includes forming silicon carbon regions embedded in the semiconductor substrate on both sides of the dummy gate structure in the NMOS region, removing the hard mask layer on top of the dummy gate in the NMOS region, and forming silicon germanium regions embedded in the semiconductor substrate on both sides of the dummy gate structure in the PMOS region. After forming the silicon carbon regions and the silicon germanium regions, while retaining the hard mask layer on top of the dummy gates in the PMOS region, performing ion implant to form source/drain regions in the NMOS region and the PMOS region.

Methods for high-k metal gate CMOS with SiC and SiGe source/drain regions

Embodiments in accordance with the present invention provide methods of forming a metal interconnect structure which avoid defects arising from copper migration. In accordance with particular embodiments, an electroplated copper feature is subjected to a brief thermal anneal prior to chemical mechanical polishing and subsequent formation of an overlying barrier layer. This thermal anneal intentionally provokes migration of the copper and resulting formation of hillocks or voids, which are then removed by a CMP step. The barrier layer may thus subsequently be formed over a defect-free surface, which has already experienced stress release along grain boundaries as a result of the thermal treatment.

Method to eliminate Cu dislocation for reliability and yield

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Shanghai, China

Gang Mao