Infineon Technologies Ag

Other

G&uuml;nther Schindler

Walter Hartner

Volker Weinrich

Frank S Hintermaier

Carlos Mazure-Espejo

Manfred Engelhardt

Rainer Bruchhaus

Christine Dehm

Marcus Kastner

Mattias Ahlstedt

Georg Braun

Hermann Wendt

Heinz Hoenigschmid

Thomas Roehr

Narayan Solayappan

Vikram Joshi

Zvonimir Gabric

Gerhard Beitel

Igor Kasko

Matthias Kr&ouml;nke

Wolfgang H&ouml;nlein

Robert Primig

Renate Bergmann

Manfred M&ouml;rt

Carlos Mazur&eacute;-Espejo

A method for removing structures from a substrate is described. The method includes providing a substrate that has the structures that must be removed, applying a sacrifice layer, and removing the structures and the sacrifice layer in a polishing step. The method has the advantage that the sacrifice layer surrounds the structures that must be removed and stabilizes them, so that the structures can be eroded slowly and successively in the subsequent polishing step without breaking off. This prevents a smearing of the material of the structures such as occurs given direct polishing without a sacrifice layer.

Method for removing structures

A method for structuring ferroelectric layers on semiconductor substrates retains or regenerates the adherence and breakdown voltage resistance of the ferroelectric layer, which is especially significant for producing storage capacitors in large-scale integrated FeRAM and DRAM memory components. The addition of H O or O results principally in the recovery of the electrostatic breakdown strength of the ferroelectric layer, which is of importance in particular when the ferroelectric serves as a dielectric of a storage capacitor and has to withstand electric fields of 5-10&times;10 V/m without a significant leakage current.

Method of patterning ferroelectric layers

A method for fabricating a semiconductor component includes the steps of applying an electrode material and a metal-oxide-containing layer on a substrate surface and selectively etching the electrode material and the metal-oxide-containing layer for forming a first electrode from the electrode material and forming a metal oxide layer from the metal-oxide-containing layer, wherein the metal oxide layer is disposed on top of the first electrode. The method further includes conformally applying a conductive material which has a given material thickness, anisotropically etching the conductive material for fabricating a resistance element in the form of a self-aligned lateral edge web on at least one sidewall of the metal oxide layer and of the first electrode, and applying a further electrode material at least on the resistance element for forming a second electrode.

Method for fabricating non-volatile memories

A method for fabricating a microelectronic component includes the step of applying a barrier against the passage of hydrogen to a storage capacitor having a ferroelectric dielectric or a paraelectric dielectric. During the formation of the barrier, firstly a silicon oxide layer is produced, the latter is then subjected to a heat treatment and a barrier layer is subsequently applied. A microelectronic component has a storage capacitor and a barrier including a silicon oxide layer and a barrier layer. The silicon oxide layer is disposed on an electrode of the storage capacitor and has been subjected to a heat treatment in an oxygen-containing atmosphere. The barrier layer is disposed on the silicon oxide layer and protects the storage capacitor against a passage of hydrogen through the barrier.

Method for fabricating a microelectronic component

A method of fabricating semiconductor circuits having integrated capacitors that have a dielectric or a ferroelectric material between electrodes. The materials are subjected to heat treatment at high temperatures in an oxygen atmosphere for the purpose of crystallization. The dielectric or ferroelectric is heated separately from the semiconductor substrate, is comminuted into small particles and only afterward applied in this form to the semiconductor substrate. This makes it possible to integrate substances with arbitrarily high crystallization temperature without damaging the integrated semiconductor circuit, since the semiconductor substrate itself does not have to be heated. Diffusion barriers for oxygen are unnecessary. Previous limitations on the capacitor capacitance are obviated owing to the free choice of dielectric or ferroelectric made possible, and the packing density of the capacitors is increased.

Method for fabricating an integrated semiconductor circuit having a strongly polarizable dielectric or ferroelectric

A semiconductor memory configuration has a plurality of selection transistors. Each selection transistor is connected to a first electrode of a storage capacitor. A second electrode of the storage capacitor is connected to a common plate. The common plate is provided below the selection transistors in a semiconductor body. A method of fabricating a semiconductor memory configuration is also provided.

Integrated semiconductor memory configuration with a buried plate electrode and method for its fabrication

A process for producing structured layers on a base body, in particular a semiconductor body, includes the steps of providing a first layer, structuring the first layer with a partial or complete local layer erosion to form raised and recessed layer regions, and depositing a second layer. The structured first layer is a provided as a permanently remaining layer. Edges are formed at transitions from raised to recessed layer regions. The height difference at the edges of the structured first layer separates individual layer regions of the second layer. The edges of the raised regions act as partition edges for the second layer. A process for producing components of an integrated circuit and a process for producing a memory configuration are also provided.

Process for producing structured layers, process for producing components of an integrated circuit, and process for producing a memory configuration

After an SBT layer is precipitated onto a substrate, the SBT layer is structured as a still amorphous layer. Only subsequently is it subjected to a crystallization process. Layers produced in this manner have a relatively high degree of dielectric strength and have no stoichiometric deviations on the etched edges.

Method for preventing etching-induced damage to a metal oxide film by patterning the film after a nucleation anneal but while still amorphous and then thermally annealing to crystallize

A method of producing a ferroelectric semiconductor memory, includes forming a switching transistor on a semiconductor substrate, applying an insulating layer to the switching transistor and then forming a storage capacitor, with electrodes of platinum and a ferroelectric or paraelectric dielectric, on the insulating layer. In order to protect the dielectric from being penetrated by hydrogen during further process steps, a first barrier layer is embedded into the insulating layer and, after completion of the storage capacitor, a second barrier layer, which bonds with the first barrier layer, is deposited.

Method of producing a ferroelectric semiconductor memory

In a method for fabricating a high-epsilon dielectric/ferroelectric capacitor, a patterning layer with a central base layer zone and a Si-filled trench laterally surrounding the latter is produced. Above that, a metal layer is deposited and is silicided above the Si-filled trench. Through oxidation of the silicided metal layer section the latter migrates into the trench and a base electrode is formed above the base layer zone.

Method for patterning a metal or metal silicide layer and a capacitor structure fabricated by the method

A random access memory having a multiplicity of memory cells having logic states that can be changed by a control voltage. At least some of the memory cells include an additional device that can be activated by means of an enforced control voltage that is different from the control voltage, in order to impress a defined logic state on the memory cell.

Random access memory with hidden bits

The damage to edge sections which occurs during the patterning of a metal-oxide-containing layer can be compensated by the deposition of an annealing layer and a subsequent heat treatment step through which a material flow takes place from the annealing layer into the damaged edge sections. The metal-oxide-containing layer can form the dielectric of a storage capacitor of a DRAM memory cell.

Method for fabricating a patterned metal-oxide-containing layer

The invention provides a method. In a first step of a method for fabricating a ferroelectric memory configuration, there is provided a substrate having a multiplicity of memory cells. Each of the memory cells has at least one select transistor, at least one short-circuit transistor, and at least one ferroelectric capacitor. The transistors are connected in an electrically conductive manner to a first of the electrodes of the ferroelectric capacitor. In the next step, at least one electrically insulating layer is applied. In the next step, at least one contact hole for connecting a second electrode of the ferroelectric capacitors is produced. Next, contact holes for connecting the short-circuit transistors are produced. Next, the contact holes are filled with electrically conductive material. Next, an electrically conductive layer is applied and patterned, so that the second electrodes of the ferroelectric capacitors are each conductively connected to the short-circuit transistors.

Method for fabricating a ferroelectric memory configuration

A method for fabricating a patterned layer from a layer material. The method includes steps of: providing a substrate with at least one target region and at least one migration region; applying a layer material; adding a material to the layer material; and performing a heat treatment such that the layer material migrates from the migration region to the target region and a layer which is self-aligned and self-patterned with respect to the target region is formed. The method has the advantage that the layer material, which can often only be etched with difficulty, does not have to be patterned directly. The desired structure of the layer is predetermined by preliminarily structuring the substrate into a target region and a migration region, and is produced by the migration of the layer material as a result of the heat treatment.

Method for fabricating a patterned layer

The invention relates to a ferroelectric RAM configuration, including a number of storage cells, each of which has a selection transistor and a capacitor device with a ferroelectric dielectric. The capacitor device includes at least two capacitors whose coercive voltages are different from each other.

Growing community of inventors

München, Germany

Günther Schindler

Growing community of inventors

München, Germany

G&uuml;nther Schindler

Günther Schindler