Ebara Corporation

Fujihiko Toyomasu

Junji Kunisawa

Toru Maruyama

Mitsuru Miyazaki

Koji Maeda

Mitsunori Komatsu

Haiyang Xu

Takashi Tanaka

Takashi Tsuzuki

Kuniaki Yamaguchi

Kenichiro Saito

Hiroshi Aono

Koichi Hashimoto

Kiyotaka Kawashima

Mitsuhiko Inaba

Hiroshi Shimomoto

Masayoshi Imai

Kenji Shinkai

Teruaki Hombo

Hidetatsu Isokawa

Mutsumi Tanikawa

Tetsuya Yashima

The present disclosure provides a chemical supply apparatus, a cleaning system, and a chemical supply method that can supply a cleaning chemical to two nozzles and also supply the cleaning chemical at a set flow rate to one of the nozzles. A chemical supply apparatus according to the present disclosure includes: a first cleaning chemical supply pipe; a first mixer that mixes a first chemical and water to generate a first cleaning chemical; and a first supply controller, wherein the first cleaning chemical supply pipe includes an upstream pipe forming a channel from the first mixer to a first junction, a first pipe forming a channel from the first junction to a first nozzle, and a second pipe forming a channel from the first junction to a second nozzle, and the first supply controller is configured to execute a feedback control on the basis of the flow rate of the first cleaning chemical inside the first pipe of the first cleaning chemical supply pipe so that the flow rate of the first cleaning chemical flowing through the first pipe of the first cleaning chemical supply pipe is a set flow rate.

Chemical supply apparatus, cleaning system, and chemical supply method

To improve liquid draining of a liquid supplying device. A method for draining a liquid of a pipe of a liquid supplying device including a step for drying an inside of the pipe by circulating an inert gas in the pipe without dividing the pipe, wherein the step for drying includes a step for protecting a pressure sensor from static electricity, through a pressure sensor that has a sensor covered portion electrically connected with a housing of the liquid supplying device, the sensor covered portion is exposed to the inside of the pipe or exposed to a flow path communicating with the inside of the pipe.

Liquid supplying device and method for draining liquid thereof

There is provided an apparatus for supplying liquid, comprising a flow controller configured to measure a flow rate of a liquid and control the flow rate based on a measurement value; a first valve connected with the flow controller to control supply of a first liquid to the flow controller; a second valve connected with the flow controller to control supply of a second liquid to the flow controller; and a control device configured to control the first valve and the second valve, wherein the control device switches over the first valve and the second valve with providing a delay time between an open/closed switchover time of the first valve and an open/closed switchover time of the second valve.

Apparatus for supplying liquid, cleaning unit, and apparatus for processing substrate

A cleaning liquid supply device for supplying a cleaning device with cleaning liquid includes a chemical liquid inlet portion and a dilution water inlet portion, a first chemical liquid control unit fluidically connected to the chemical liquid inlet portion and the dilution water inlet portion, and a second chemical liquid control unit fluidically connected to the chemical liquid inlet portion and the dilution water inlet portion. The first chemical liquid control unit includes a first chemical-liquid-flow-rate control unit, a first dilution-water-flow-rate control unit, and a first mixing portion. The second chemical liquid control unit includes a second chemical-liquid-flow-rate control unit, a second dilution-water-flow-rate control unit, and a second mixing portion.

Cleaning liquid supply device, cleaning unit, and storage medium storing program

A cleaning chemical liquid supply device includes: first and second mixers respectively mixing first chemical liquid with dilution water and respectively supplying to first and second nozzles respectively supplying the first chemical liquid adjusted to desired flow rates and concentrations to a first position and a second, different position of the substrate in the cleaning device; a first dilution water control box controlling flow rates of the dilution water supplied to the first and second mixers; third and fourth mixers respectively mixing second, different chemical liquid with the dilution water and respectively supplying to third and fourth nozzles for respectively supplying the second chemical liquid adjusted to desired flow rates and concentrations to a third position and a fourth, different position of the substrate in the cleaning device; and a second dilution water control box controlling flow rates of the dilution water supplied to the third and fourth mixers.

Cleaning chemical liquid supply device and cleaning chemical liquid supply method

The present invention provides a liquid supplying device that can determine whether a CLC can be used appropriately. A liquid supplying device for supplying a liquid from a liquid source to a cleaning device is provided. The liquid supplying device includes a flow rate control device that measures a flow rate of a liquid from the liquid source and controls the flow rate based on the measured value, an IN-side pressure gauge provided between the liquid source and the flow rate control device and an OUT-side pressure gauge provided between the flow rate control device and the cleaning device.

Liquid supplying device and liquid supplying method

The cleaning apparatus includes multiple kinds of cleaning modules each configured to perform a cleaning processing of a substrate, a first accommodating section configured to accommodate the multiple kinds of cleaning modules therein, and a fluid supply section configured to supply a fluid to the cleaning modules accommodated in the first accommodating section through a pipe. Each of the multiple kinds of cleaning modules includes a pipe connection portion having a common connection position to be connected with the pipe.

Cleaning apparatus and substrate processing apparatus

The present invention relates to a substrate processing apparatus for processing a substrate, such as a wafer, while supplying a cleaning liquid (e.g. pure water and a liquid chemical) to the substrate, and also relates to a pipe cleaning method for the substrate processing apparatus. The substrate processing apparatus includes: a first cleaning lane including first cleaning units (), () each for cleaning a substrate while supplying pure water to the substrate; a second cleaning lane including second cleaning units (), () each for cleaning a substrate while supplying pure water to the substrate; a first pure-water supply pipe () for supplying the pure water to the first cleaning lane; and a second pure-water supply pipe () for supplying the pure water to the second cleaning lane.

Substrate processing apparatus and pipe cleaning method for substrate processing apparatus

A substrate cleaning apparatus includes: a pure water supply line provided with a pure water flow regulator and a pure water supply valve; chemical supply lines each provided with a chemical flow regulator and a chemical supply valve; a merging line where pure water and a plurality of liquid chemicals meet to form a cleaning liquid; a cleaning liquid supply line configured to supply the cleaning liquid to a substrate; and a controller configured to control the pure water flow regulator, the pure water supply valve, the chemical flow regulators, and the chemical supply valves such that the pure water and the plurality of liquid chemicals are present at a predetermined ratio at a meeting point.

Substrate cleaning apparatus and substrate cleaning method

A cleaning chemical supplying device, a cleaning chemical supplying method, and a cleaning unit capable of flexibly handling a change of a dilution ratio and suppression of an increase of a device size are provided. A cleaning chemical supplying device has a first in-line mixer, a second in-line mixer, a first chemical CLC box, a second chemical CLC box, and a DIWCLC box.

Cleaning chemical supplying device, cleaning chemical supplying method, and cleaning unit

A method for feeding slurry, and a slurry feeder capable of feeding slurry to a chemical mechanical polishing apparatus, are disclosed. Slurry is fed from a slurry supply tank, that stores slurry at a given concentration, to chemical mechanical polishing apparatuses via slurry feed pumps. Operations of the slurry feed pumps are suspended during a period of time other than during a time of feeding slurry to the chemical mechanical polishing apparatuses. A slurry feeder for feeding a slurry to a polishing apparatus includes a pump for feeding slurry at a flow rate Q from a slurry supply tank to the polishing apparatus. When a given sedimentation velocity of slurry is indicated by V, a horizontal sectional area of the slurry supply tank is set to become smaller than Q/V.

Method for supplying slurry to polishing apparatus

An abrasive liquid feed apparatus comprises a supply tank for storing an abrasive liquid having a predetermined concentration, an abrasive liquid pipe for transferring the abrasive liquid from the tank to a polishing means and an additive feed means which feeds an additive having a predetermined concentration to the tank. It further comprises an additive concentration measurement means which measures a concentration of the additive in the abrasive liquid in the supply tank, a measurement means which measures an amount of the abrasive liquid in the tank and a control which calculates an amount of the additive to be supplemented to the tank, based on the concentration of the additive measured by the additive concentration measurement means and the amount of the abrasive liquid measured by the metering means. To maintain the concentration of aqueous hydrogen peroxide in the abrasive liquid.

Abrasive liquid feed apparatus, method for feeding additive to abrasive liquid feed apparatus, and polishing apparatus

An apparatus for supplying a polishing liquid to a polishing section is used for polishing a surface of a semiconductor substrate in the polishing section. The apparatus comprises a supply tank for storing a polishing liquid having given properties, a supply pipe for supplying the polishing liquid to the polishing section, a sensing device for detecting properties of the polishing liquid flowing through the supply pipe, and a stabilization device for maintaining properties of the polishing liquid stored in the supply tank or flowing through the supply pipe within an allowable range on the basis of an output signal from the sensing device.

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Tokyo, Japan

Fujihiko Toyomasu