Taiwan Semiconductor Manufacturing Comp. Ltd.

TSMC China Company Limited

Elite Semiconductor Memory Technology, Inc

Aiwan Semiconductor Manufacturing Company, Ltd.

Fu-An Wu

Cheng Hung Lee

Jung-Ping Yang

Chia-En Huang

Chih-Chieh Chiu

Chen-Lin Yang

I-Han Huang

Hung-Jen Liao

Chiting Cheng

Yangsyu Lin

Yih Wang

Jonathan Tsung-Yung Chang

Yu-Hao Hsu

Hao-I Yang

Yen-Huei Chen

Ku-Feng Lin

Wei Min Chan

Hong-Chen Cheng

Jui-Che Tsai

Chien-Chen Lin

Meng-Sheng Chang

Ching-Wei Wu

Hau-Tai Shieh

Yao-Jen Yang

Yi-Tzu Chen

Chun-Jiun Dai

Hiroki Noguchi

Perng-Fei Yuh

He-Zhou Wan

XiuLi Yang

Tsung-Hsien Huang

Hsiao-Lan Yang

Chi-Kai Hsieh

Wun-Jie Lin

Cheng-Hung Lee

Ming-Yi Lee

Yi-Hung Tsai

Wei-Shuo Kao

Ling-Chang Hu

Disclosed herein is an integrated circuit including multiple magnetic tunneling junction (MTJ) cells coupled to a static random access memory (SRAM). In one aspect, the integrated circuit includes a SRAM having a first port and a second port, and a set of pass transistors coupled to the first port of the SRAM. In one aspect, the integrated circuit includes a set of MTJ cells, where each of the set of MTJ cells is coupled between a select line and a corresponding one of the set of pass transistors.

Non-volatile static random access memory (NVSRAM) with multiple magnetic tunnel junction cells

A method includes: coupling a first gate to a first word line through a first gate via, wherein the first gate extends along a first direction; coupling the first gate to a second word line through a second gate via, wherein each of the first gate, a second gate, the first gate via and the second gate via is disposed on a first active area which extends along the second direction, wherein the second gate extends along the first direction and is separated from the first gate along a second direction; coupling the first active area to a first bit line through a first conductive via; and aligning the first gate via, the second gate via and the a first conductive via with each other along the second direction.

Method of manufacturing semiconductor device

An integrated circuit includes a memory cell array, a row decoder configured to generate a first decoder signal, a column decoder configured to generate a second decoder signal, and an array of write assist circuits coupled to the row and column decoder and the memory cell array. Each write assist circuit is configured to set an operating voltage of a corresponding memory cell, and generate the output signal in response to a first control signal. The operating voltage corresponds to an output signal. Each write assist circuit includes an AND gate coupled to a programmable voltage tuner. The programmable voltage tuner includes a set of P-type transistors coupled to a first P-type transistor. The set of P-type transistors is coupled together in parallel, and receives a set of select control signals. A first terminal of the first P-type transistor is configured to receive an AND signal from the AND gate.

Three-dimensional (3-D) write assist scheme for memory cells

A semiconductor device includes anti-fuse cells. The anti-fuse cells include a first active area, a first gate, a second gate, at least one first gate via, and at least one second gate via. The first gate and the second gate are separate from each other. The first gate and the second gate extend to cross over the first active area. The at least one first gate via is coupled to the first gate and disposed directly above the first active area. The at least one second gate via is coupled to the second gate. The first gate is coupled through the at least one first gate via to a first word line for receiving a first programming voltage, and the second gate is coupled through the at least one second gate via to a second word line for receiving a first reading voltage.

Semiconductor device

A memory circuit includes a NAND logic gate configured to receive a first bit line signal and a second bit line signal, and to generate a first signal. The memory circuit further includes a first P-type transistor coupled to the NAND logic gate, and configured to receive a first clock signal. The memory circuit further includes a first N-type transistor coupled to the NAND logic gate, and configured to receive a first pre-charge signal. The memory circuit further includes a first latch coupled to the NAND logic gate, and configured to latch the first signal in response to at least the first clock signal or the first pre-charge signal.

Memory circuit and method of operating the same

Non-volatile static random access memory (nvSRAM) with multiple magnetic tunnel junction cells

A memory circuit includes a NAND logic gate configured to receive a first bit line signal and a second bit line signal, and to generate a first signal. The memory circuit further includes a first N-type transistor coupled to the NAND logic gate, and configured to receive a first pre-charge signal. The memory circuit further includes a second N-type transistor coupled to the first N-type transistor and a reference voltage supply, and configured to receive a first clock signal. The memory circuit further includes a first latch coupled to the NAND logic gate, and configured to latch the first signal in response to at least the first clock signal or the first pre-charge signal.

A clock circuit includes a latch circuit, a memory state latch circuit, a first inverter, a memory state trigger circuit and a second inverter. The latch circuit is configured to latch an enable signal, and to generate a latch output signal based on a first clock signal and a first output clock signal. The memory state latch circuit is configured to latch a second output clock signal responsive to a third output clock signal. The first inverter is configured to generate the first output clock signal responsive to the third output clock signal. The memory state trigger circuit is configured to generate the second output clock signal responsive to the latch output signal. The second inverter is configured to generate the first clock signal responsive to a second clock signal, and configured to control the latch circuit and the memory state trigger circuit based on the first clock signal.

Clock circuit and method of operating the same

Various embodiments for configurable memory storage systems are disclosed. The configurable memory storages selectively choose an operational voltage signal from among multiple voltage signals to dynamically control various operational parameters. For example, the configurable memory storages selectively choose a maximum voltage signal from among the multiple voltage signals to maximize read/write speed. As another example, the configurable memory storages selectively choose a minimum voltage signal from among the multiple voltage signals to minimize power consumption.

Configurable memory storage system

A structure includes anti-fuse cells. The anti-fuse cells include a first active area, a first gate, a second gate, at least one first gate via, and at least one second gate via. The first gate and the second gate are separate from each other. The first gate and the second gate extend to cross over the first active area. The at least one first gate via is coupled to the first gate and disposed directly above the first active area. The at least one second gate via is coupled to the second gate. The first gate is coupled through the at least one first gate via to a first word line for receiving a first programming voltage, and the second gate is coupled through the at least one second gate via to a second word line for receiving a first reading voltage.

Semiconductor device including anti-fuse cell

A memory circuit includes a NAND logic gate, a first N-type transistor, a second N-type transistor, a first inverter and a first latch. The NAND logic gate is configured to receive a first bit line signal and a second bit line signal, and to generate a first signal. The first N-type transistor is coupled to the NAND logic gate, and configured to receive a first pre-charge signal. The second N-type transistor is coupled to the first N-type transistor and a reference voltage supply, and configured to receive a first clock signal. The first inverter is coupled to the NAND logic gate, and configured to output a data signal inverted from the first signal. The first latch is coupled to the NAND logic gate, and configured to latch the first signal in response to at least the first clock signal or the first pre-charge signal.

An integrated circuit includes an array of write assist circuits electrically connected to a memory cell array. Each write assist circuit is configured to set an operating voltage of a corresponding memory cell. Each write assist circuit is configured to receive at least a first control signal, and generate an output signal at least in response to the first control signal. The output signal controlling the operating voltage of the corresponding memory cell. Each write assist circuit includes a programmable voltage tuner. The programmable voltage tuner includes a first P-type transistor and a second P-type transistor coupled to the first P-type transistor. A first terminal of the first P-type transistor is configured as a first input node to receive a first select control signal. A first terminal of the second P-type transistor is configured as a second input node to receive a second select control signal.

A clock circuit includes a latch circuit, a memory state latch circuit, a memory state trigger circuit and a clock trigger circuit. The latch circuit is configured to latch an enable signal, and to generate a latch output signal based on a first clock signal or an output clock signal. The memory state latch circuit is configured to generate the output clock signal responsive to a first control signal. The memory state trigger circuit is coupled to the memory state latch circuit, and configured to adjust the output clock signal responsive to the latch output signal. The clock trigger circuit is coupled to the latch circuit or the memory state trigger circuit by a first node, configured to generate the first clock signal responsive to a second clock signal, and configured to control the latch circuit and the memory state trigger circuit based on the first clock signal.

Various embodiments for configurable memory storage systems are disclosed. The configurable memory storages selectively choose an operational voltage signal from among multiple operational voltage signals to dynamically control various operational parameters. For example, the configurable memory storages selectively choose a maximum operational voltage signal from among the multiple operational voltage signals to maximize read/write speed. As another example, the configurable memory storages selectively choose a minimum operational voltage signal from among the multiple operational voltage signals to minimize power consumption.

Growing community of inventors

Hsinchu, Taiwan

Fu-An Wu