Lam Research Corporation

Fred Egley

Hong Shih

Duane Outka

Michael S Kang

Anthony L Chen

Bruno Morel

Jack Kuo

Changyou Jing

Peter Norton

John A Distinti

Andrea Wang

John Edward Daugherty

Maolin Long

Eric A Pape

Fangli J Hao

Seyed Jafar Jafarian-Tehrani

Thomas W Anderson

Tuochuan Huang

Tao Zhang

Allan Kent Ronne

Jorge Jose Zaninovich

Michael Giarratano

John W Rasnick

Josh Cormier

Ralph Lu

William T Hart

A substrate support assembly comprises a first optical receiver, a power converter, a first circuit, and a first optical transmitter, all embedded in the substrate support assembly. The first optical receiver is configured to receive a first optical signal and a first optical data through a fiber optic cable. The power converter is configured to generate DC power based on the first optical signal and the first optical data received by the first optical receiver. The first circuit is configured to receive the DC power from the power converter and to receive a second data from a sensor disposed in the substrate support assembly in response to the first optical data. The first optical transmitter is configured to transmit the second data as a second optical data through the fiber optic cable.

Power and data transmission to substrate support in plasma chambers via optical fiber

A temperature controller for a substrate support in a substrate processing system includes memory that stores a first model correlating temperatures of a plurality of first thermal control elements (TCEs) arranged in the substrate support and first temperature responses of the substrate support. The first temperature responses correspond to locations on a surface of the substrate support. A temperature estimation module calculates resistances of the first TCEs, determines, based on the calculated resistances, the temperatures of the first TCEs, and estimates, using the stored first model and the determined temperatures of the first TCEs, an actual temperature response of the substrate support. The temperature controller is configured to control the first TCEs based on the actual temperature response of the substrate support.

Virtual metrology method for ESC temperature estimation using thermal control elements

A substrate processing system includes a processing chamber, a pedestal arranged in the processing chamber, and an electrostatic chuck (ESC) arranged on the pedestal. The ESC contains a printed circuit board assembly (PCBA) made up of a plurality of printed circuit board layers to mount circuitry that controls operation of the ESC. One or more of the printed circuit board layers includes a heater layer having one or more metal traces, which may be copper, to cover some or all of a surface of the heater layer sufficiently to provide heat to one or more of the remaining printed circuit board layers, to maintain the circuitry within a predetermined temperature range. The heat may be conducted directly among the various other printed circuit board layers, or may be conducted through vias in various ones of the printed circuit board layers.

Substrate processing system printed-circuit control board assembly with one or more heater layers

A method of using a thermocouple is provided. The method includes, but is not limited to, disposing at least one temperature sensor at each of two or more respective portions of an electrical connector adapted to receive thermocouple signals, measuring temperatures at the two or more portions, and calculating the temperatures at each terminal of the electrical connector based on measured temperature values of the two or more respective portions having the disposed temperature sensors. The method also includes, but is not limited to, calculating a cold junction temperature of a terminal for at least one thermocouple channel carrying the thermocouple signals based on measured or calculated temperature values of the terminals, or a combination thereof.

Multichannel thermocouple compensation for three dimensional temperature gradient

A direct drive arrangement for controlling pressure volume within a confinement region of a processing chamber of a plasma processing system during substrate processing is provided. The confinement region is a chamber volume surrounded by confinement rings is provided. The arrangement includes plunger assemblies configured for changing the pressure of motor assemblies configured for vertically moving the plunger assemblies, and recording set point position values for the plunger assemblies. The arrangement further includes a set of circuits configured for driving the motor assemblies to move the plunger assemblies to change the pressure volume within the confinement region. The set of circuits is also configured for providing power to the motor assemblies. The set of circuits is further configured for receiving the set point position values from the motor assemblies.

Direct drive arrangement to control confinement rings positioning and methods thereof

Bare aluminum baffles are adapted for resist stripping chambers and include an outer aluminum oxide layer, which can be a native aluminum oxide layer or a layer formed by chemically treating a new or used bare aluminum baffle to form a thin outer aluminum oxide layer.

Bare aluminum baffles for resist stripping chambers

An automated hydrogen bubble detection apparatus includes a horizontal support surface on which a test coupon can be supported, a transparent tube having an open top and an open bottom and operable to contain a test solution when positioned on a test coupon, a camera arranged to view a test solution in the transparent tube, and a controller in communication with the camera and effective to operate the camera such that at least one video segment is recorded by the camera and analyzed to detect first bubble and continuous bubble generation. A method of evaluating corrosion resistance of coatings on aluminum and steel in acidic solution is also included.

Automated bubble detection apparatus and method

A filter for filtering radio frequency (RF) power transmitted from an electrostatic chuck (ESC) in a plasma processing system. The plasma processing system may include a heating element disposed at the ESC. The plasma processing system may further include a power supply. The filter may include a core member and a cable wound around and wound along the core member to form a set of inductors. The cable may include a plurality of wires, including a first wire and a second wire, a portion of the first wire and a portion of the second wire being twisted together, a first end of the first wire and a first end of the second wire being connected to the heating element, each of a second end of the first wire and a second end of the second wire being connected to a capacitor and being connected to the power supply.

Radio frequency (RF) power filters and plasma processing systems including RF power filters

A UV lamp assembly having rotary shutters. Each rotary shutter has a concave wall with a reflective concave surface. The rotary shutters can be collectively rotated between an open position and an closed position. At the open position, the rotary shutters do not block UV light of UV lamps from leaving the UV lamp assembly while at the closed position the rotary shutters block UV light from leaving the UV lamp assembly.

UV lamp assembly of degas chamber having rotary shutters

Growing community of inventors

Sunnyvale, CA, United States of America

Fred Egley