Kla Instruments Corporation

Fred E Babian

Scott Allen Young

Curt H Chadwick

Kent E Douglas

Roger Kroeze

Nicholas Szabo

Bin-ming B Tsai

A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, those electronic images are compared to detect any defects that may exist on one of the die.

Alignment correction prior to image sampling in inspection systems

A method of inspecting repeating pattern devices according to which an image of the patterns is aligned with an array of pixels in the image detection plane of an optical detector. The image is magnified to a scale so that features of patterns repeated in the image occupy corresponding pixels or groups of pixels repeated in the array. Data is resolved from selected pixels and directly compared either to data obtained from corresponding pixels or from a data base, whereby defective features are identified through well-known data comparison techniques.

Method and apparatus for detecting defects in repeated microminiature

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Boulder Creek, CA, United States of America

Fred E Babian