Carl Zeiss Smt Gmbh

Asml Netherlands B.v.

Carl-Zeiss-Smt Ag

Franz-Josef Stickel

Ulrich Loering

Oliver Natt

Markus Hauf

Stefan Hembacher

Timo Laufer

Guido Limbach

Holger Walter

Norman Baer

Gero Wittich

Yim-Bun-Patrick Kwan

Jan Van Schoot

Peter Kuerz

Karl-Heinz Schuster

Alexander Epple

Juergen Mueller

Robert Fichtl

Wolfgang Singer

Hans-Juergen Mann

Johannes Wangler

Aurelian Dodoc

Dirk Heinrich Ehm

Hans-Juergen Rostalski

Aksel Goehnermeier

Joachim Hartjes

Hartmut Enkisch

Sonja Schneider

Vladimir Kamenov

Kerstin Hild

Johann Trenkler

Oliver Dier

Joachim Wietzorrek

Frank Schillke

Sascha Migura

Joerg Schultz

Gerd Reisinger

Stefan Kraus

Siegfried Rennon

Gordon Doering

Martin Rocktaeschel

Tobias Hackl

Björn Liebaug

Jürgen Hofmann

Dietmar Dürr

Andreas Wolpert

Tilmann Assmus

Manfred Matena

Marc Saitner

Hans-Peter Brust

Tilmann AßMUS

Ulrich LÖRING

Jürgen MÜLLER

A method for the zonal polishing of a workpiece includes using a polishing tool to guide a structured polishing pad over the surface of workpiece to remove material from the workpiece. A structured polishing pad includes a structuring adapted to the movement of a polishing tool.

Method for machining a workpiece in the production of an optical element

A method for polishing a workpiece in the production of an optical element, in particular for microlithography, wherein a relative movement takes place between a polishing tool () and a workpiece surface () being machined. A polishing tool surface () of the polishing tool () is formed by a viscoelastic polishing medium (), wherein the polishing tool surface has an average diameter which is less than 50% of the average diameter of the workpiece surface being machined. The polishing tool surface during polishing is guided by an overrun distance beyond at least one edge () delimiting the workpiece surface being machined, wherein the average diameter of the polishing tool surface is at least twice the overrun distance.

Method for polishing a workpiece in the production of an optical element

A lithography machine includes an optical element, an interface coupled to the optical element, and a component which is separate from the interface. The interface is directly connected to the optical element. The optical element includes an engaging section. The component has a counter engaging section configured to engage with the engaging section of the optical element to connect the component form-fittingly and/or force-fittingly to the optical element.

Lithography apparatus and method

A projection lens of an EUV-lithographic projection exposure system with at least two reflective optical elements each comprising a body and a reflective surface for projecting an object field on a reticle onto an image field on a substrate if the projection lens is exposed with an exposure power of EUV light, wherein the bodies of at least two reflective optical elements comprise a material with a temperature dependent coefficient of thermal expansion which is zero at respective zero cross temperatures, and wherein the absolute value of the difference between the zero cross temperatures is more than 6K.

EUV exposure apparatus with reflective elements having reduced influence of temperature variation

A method for producing an optical element includes: providing a substrate (), applying a layer system (), wherein an optically effective surface () is formed and wherein the layer system has a layer () that is thermally deformable for manipulating the geometric shape of the optically effective surface, and applying a temperature field to the optical element while at least regionally heating the thermally deformable layer to above a specified operating temperature of the optical system. The thermally deformable layer is configured such that a deformation that is induced when the temperature field is applied is at least partially maintained after the optical element has cooled. Also disclosed is an optical element () that has an optically effective surface (), a substrate (), and a layer system () that has a reflection layer system (), which includes a shape-memory alloy.

Method for producing an optical element for an optical system, in particular for a microlithographic projection exposure apparatus

A mirror () for EUV lithography includes a substrate () and a reflective coating (). The reflective coating has a first group () of layers () and a second group () of layers (), wherein the first group and second group of layers () reflect radiation having a used wavelength between 5 nm and 30 nm. The first group of layers is arranged between the substrate and the second group of layers, and a decoupling coating () is arranged between the first group and second group of layers, said decoupling coating optically decoupling the second group of layers from the first group of layers by preventing the radiation having the used wavelength from reaching the first group of layers. The reflective coating preferably has a correction layer () having a layer thickness variation for correcting the surface form of the mirror.

Surface correction of mirrors with decoupling coating

A mirror including a substrate and a reflective coating that includes a first group of layers and a second group of layers arranged between the substrate and the first group of layers. Both the first and second groups of layers include a plurality of alternating first material layers and second material layers, arranged one above another. The refractive index of the first material for radiation in the range of 5-30 nm is greater than the refractive index of the second material in that wavelength range. The first group of layers is configured to have a number of layers that is greater than 20, such that, upon irradiation with radiation having a wavelength in the range of 5-30 nm, less than 20% of the radiation reaches the second group of layers, which has a layer thickness variation for correcting the surface form of the mirror.

Mirror for use in a microlithography projection exposure apparatus

A mirror () for a microlithography projection exposure apparatus including a substrate () and a reflective coating (). A functional coating () between the substrate () and the reflective coating () has a local form variation () for correcting the surface form of the mirror (), wherein the local form variation () is brought about by a local variation in the chemical composition of the functional coating () and wherein a thickness of the reflective coating () is not changed by the local variation in the chemical composition of the functional coating (). The local variation in the chemical composition of the functional coating () can be brought about by bombardment with particles (), for example with hydrogen ions.

Surface correction on coated mirrors

A projection objective is disclosed. The projection objective can include a plurality of optical elements arranged to image a pattern from an object field in an object surface of the projection objective to an image field in an image surface of the projection objective with electromagnetic operating radiation from a wavelength band around an operating wavelength &#x3bb;. The plurality of optical elements can include an optical correction plate that includes a body comprising a material transparent to the operating radiation, the body having a first optical surface, a second optical surface, a plate normal substantially perpendicular to the first and second optical surfaces, and a thickness profile defined as a distance between the first and second optical surfaces measured parallel to the plate normal. The first optical surface can have a non-rotationally symmetric aspheric first surface profile with a first peak-to-valley value PV&#x3e;&#x3bb;. The second optical surface can have a non-rotationally symmetric aspheric second surface profile with a second peak-to-valley value PV&#x3e;&#x3bb;. A thickness of the optical correction plate can vary by less than 0.1*(PV+PV)/2 across the optical correction plate.

Projection objective for microlithography, projection exposure apparatus, projection exposure method and optical correction plate

An optical imaging system for a microlithography projection exposure system is used for imaging an object field arranged in an object plane of the imaging system into an image field arranged in an image plane of the imaging system. A projection objective or a relay objective to be used in the illumination system can be involved, in particular. The imaging system has a plurality of lenses that are arranged between the object plane and the image plane and in each case have a first lens surface and a second lens surface. At least one of the lenses is a double aspheric lens where the first lens surface and the second lens surface is an aspheric surface. Lenses of good quality that have the action of an asphere with very strong deformation can be produced in the case of double aspheric lenses with an acceptable outlay as regards the surface processing and testing of the lens surfaces.

Lithography lens system and projection exposure system provided with at least one lithography lens system of this type

A lens has at least one aspheric lens surface, an objective with at least one aspheric lens surface, and a projection exposure device for microlithography and a method for the production of microstructured components with an objective having at least one aspheric lens surface. The object of the invention is to provide a method by which new designs with aspheric lens surfaces can be generated without consultation with manufacturing, with this object attained by the measure of describing the aspheric lens surfaces by Zernike polynomials, which makes it is possible to undertake a classification of aspheric lens surfaces such that the respective aspheric lens surface can be polished and tested at a justifiable cost when at least two of three, or all three, of certain conditions are present.

Objective with at least one aspheric lens

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Aalen, Germany

Franz-Josef Stickel