Applied Materials, Inc.

Applied Material, Inc.

Frank P Chang

Jun Zhao

Charles N Dornfest

Po Tang

Vincent W Ku

Talex Sajoto

Xiaoliang Jin

Ling Chen

Sasson Roger Somekh

Visweswaren Sivaramakrishnan

Christophe Marcadal

Lee Luo

Leonid Selyutin

John Vincent Schmitt

Xin Shen Guo

Chris Wang

The present invention generally provides a deposition chamber for depositing materials which require vaporization, especially low volatility precursors, which are transported as a liquid to a vaporizer to be converted to vapor phase through one or more vaporizing elements and which must be transported at elevated temperatures to prevent unwanted condensation on chamber components. In one aspect, the chamber comprises a series of heated temperature controlled internal liners as vaporizing surfaces which are configured for rapid removal, cleaning and/or replacement and preferably are made of a material having a thermal coefficient of expansion close to that of the deposition material. The vaporizing surfaces &ldquo;flash&rdquo; sprayed liquid precursors on the surface of the vaporizing surfaces and then purify the flashed precursors before flowing further into the system. Particularly contemplated is an apparatus and process for the deposition of a metal-oxide film, such as a barium, strontium, titanium oxide (BST) film, on a silicon wafer to make integrated circuit capacitors useful in high capacity dynamic memory modules. Preferably, internal surfaces of the chamber are adjustable and maintainable at a suitable temperature above ambient, e.g., about 150&deg; C. to about 300&deg; C., to prevent decomposition and/or condensation of vaporized material on the chamber and related gas flow surfaces.

High temperature filter for CVD apparatus

A deposition system for performing chemical vapor deposition comprising deposition chamber having a lid and a vaporizer attached to the lid is provided. Additionally, one or more valves disposed between the lid and the vaporizer to limit the flow of precursor material to the chamber and to improve purging of a precursor material delivery system attached to the vaporizer. The precursor delivery system has one or more conduction lines. One of the conduction lines is a flexible conduction line in the form of a multiple turn coil having a torsional elasticity suitable for allowing detachment of the lid from the chamber without having to break or disassemble a conduction line. Preferably, the flexible conduction line is a thirty (30) turn coil having a diameter of approximately three (3) inches fabricated from stainless steel tubing. Alternately, the flexible conduction line is made from a permeable membrane material such as a fluorocarbon compound such as TEFLON&reg;, a fluorocarbon containing compound or PFA 440-HP which is then encased in a sheath. The sheath is connected to a pressure control unit to allow degassing of the conduction lines and space between the conduction lines and sheath.

Method and apparatus for improved control of process and purge material in a substrate processing system

The invention relates to an apparatus and process for the vaporization of liquid precursors and deposition of a film on a suitable substrate. Particularly contemplated is an apparatus and process for the deposition of a metal-oxide film, such as a barium, strontium, titanium oxide (BST) film, on a silicon wafer to make integrated circuit capacitors useful in high capacity dynamic memory modules.

Vaporization and deposition apparatus

The invention relates to an apparatus and process for the vaporization of liquid precursors and deposition of a film on a suitable substrate. Particularly contemplated is an apparatus and process for the vaporization of a metal-oxide film, such as a barium, strontium, titanium oxide (BST) film, for deposition on a silicon wafer to make integrated circuit capacitors useful in high capacity dynamic memory modules. The vaporizer comprises thermally controlled components which are adapted for easy assembly and disassembly. A main vaporizing section provides a large heated surface for flash vaporization. A high conductance blocker is disposed at a lower end of the vaporizer to provide an extended vaporization surface. Optionally, a filter may be employed to capture unvaporized precursor droplets.

Chemical vapor deposition vaporizer

Liquid delivery system

Vaporization apparatus and process

A shielded substrate support (2) for deposition chambers (6) includes a heated base (8) having a substrate support surface (16) and a sidewall (18). A corrosion-resistant base shield (10) has cover plate (14, 22) and skirt (24) portions and is used to cover and protect the support surface and a part of the sidewall during cleaning operations. The base and the base shield have first and second CTEs, the second CTE being smaller than the first CTE. The base and base shield include complementary locking surfaces sized and positioned so that only when at a higher temperature will the locking surfaces be opposite one another to prevent removal of the base shield from the base. This eliminates the need for mechanical locking elements, such as threads, pins or twist locks, which increase the cost and can be a source of particle contamination.

Shielded substrate support for processing chamber

Growing community of inventors

San Jose, CA, United States of America

Frank P Chang