Mentor Graphics Corporation

Other

Siemens Industry Software Gmbh

Fedor G Pikus

Laurence W Grodd

Kyohei Sakajiri

John G Ferguson

David A Abercrombie

Kobi Kresh

Juan Andres Torres Robles

Patrick D Gibson

John W Stedman

Eugene Anikin

Sridhar Srinivasan

William S Graupp

Duo Ding

Phillip A Brooks

Joydeep Mitra

Kareem Madkour

Ziyang Lu

Padmaja Susarla

Jimmy Jason Tomblin

Salma Mostafa Fahmy

Muhammad Shahir Rahman

Jen-Yi Wuu

Gary S Myron

Shashank Jaiswal

Peter Louiz Rezk Beshay

A method of identifying elements in a design layout having multiple levels of hierarchical cells, each cell having one or more geometric elements, may include selecting a cell from a list of candidate cells for a level of a hierarchy; applying a local rule to the selected cell; identifying each selected cell that includes a geometric element that passes the local rule; building a list of candidate cells for a next-higher level of the hierarchy according to the identified cells; repeating the selecting, identifying, and building operations for each higher level of the hierarchy; and when a highest level of the hierarchy has been processed, returning and storing the list of candidate cells as the global solution for the applied local rule.

Systems and methods for photolithographic design

Systems and methods for multi-patterning in layout design data. A method includes receiving a coloring rule by a computer system. The method includes applying the coloring rule to the layout design data to identify a unique uncolored geometric element corresponding to the rule, by the computer system. The method includes, when the applied rule did not identify the unique uncolored geometric element corresponding to the rule, repeat the receiving and applying processes with a different coloring rule. The method includes, when the applied rule did identify the unique uncolored geometric element corresponding to the rule, assigning a patterning color to the unique uncolored geometric element, by the computer system.

Systems and methods for patterning color assignment

Disclosed systems and methods may support fabric-independent multi-patterning. A system may include a coloring constraint access engine and a fabric-independent multi-patterning engine. The coloring constraint access engine may be configured to access a set of coloring constraints to apply to geometric elements of a circuit design without accessing a fabric layer that defines a layout of the geometric elements of the circuit design, the set of coloring constraints applicable to multi-patterning the geometric elements of the circuit design to support manufacture of circuit layers using multiple manufacturing steps (e.g., via complementary lithographic masks). The fabric-independent multi-patterning engine may be configured to perform, independent of the fabric layer, a pattern coloring process according to the set of coloring constraints to determine a color assignment for the geometric elements, respectively.

Fabric-independent multi-patterning

A system may include an image clustering engine and a cluster provision engine. The image clustering image may be configured to access a set of circuit images and cluster the circuit images into different groups via an unsupervised learning process, wherein clustering by the unsupervised learning process is invariant to each invariant property of an invariant property set. A given invariant property in the invariant property set may correspond to a given image transformation, the invariant properties in the invariant property set may be discrete, and the total number of invariant properties in the invariant property set may be finite. The cluster provision engine may be configured to provide the clustered circuit images for further processing or analysis by an electronic design automation (EDA) application.

Invariant property-based clustering of circuit images for electronic design automation (EDA) applications

A system may include a quantum model engine configured to generate (e.g., load or instantiate) a quantum computing model to represent an electronic design automation (EDA) process for a circuit design. The EDA process may be a multi-patterning process to assign colors to geometric elements of the circuit design. The quantum computing model may include quantum particle types that may be defined to prohibit non-physical states in the quantum computing model from occurring. The quantum model engine may also be configured to generate a color assignment for the geometric elements of the circuit design through the quantum computing model. The system may also include a manufacture support engine configured to use the color assignment to support manufacture of circuit layers of the circuit design through multiple manufacturing steps.

Limited basis quantum particle definitions in applications of quantum computing to electronic design automation processes

Systems and methods for generating coloring constraints for layout design data. A method includes receiving or determining a constraint rule, by a computer system, for a constraint between geometric elements in the layout design data. The method includes generating constraints according to the one or more constraint rules. The method includes creating one or more groups according to the generated constraints. The method includes storing the generated constraints and the one or more groups in a design layout database. Also systems and methods for identifying elements in a design layout having multiple levels of hierarchical cells.

One or more properties can be associated with a design object in a microdevice design. The design object may be an object in a physical layout design for a microdevice, such as a geometric element in a layout design. The design object also may be a collection of geometric elements in a layout design, such as a net, a cell in a hierarchical design, or even a collection of all of the geometric elements in a layer of a design. Still further, the design object may even be an item in a logical circuit design, such as a net in a logical circuit design for an integrated circuit. The values of one or more properties may be statically assigned for or dynamically generated during a design process performed by an electronic design automation tool. A property may be assigned a constant value or a value defined by an equation or other type of script that includes one or more variables. A property may be simple, where the definition of the property's value is not dependent upon the value of any other properties. Alternately, a property may be a compound property, where the definition of the property's value incorporates another, previously-determined property value. Still further, a property may be an alternative property, where the property is assigned one value definition under a first set of conditions and assigned another value definition under a second set of conditions. A first electronic design automation process may generate one or more property values. The generated property values then can be passed to another electronic design automation process in the design analysis flow for its use.

Properties in electronic design automation

A check for determining the appropriateness of physical design data is provided, where the check includes both a physical component and a logical component. Based upon the logical component of the check, portions of the physical design data that correspond to the logical component are identified and selected. After the portions of the physical design data corresponding to the logical component have been selected, this physical design data can be provided to a physical design analysis tool, along with the physical component of the design check. The physical design analysis tool can then use the physical component of the design check to perform an analysis of the selected physical design data.

Logic-driven layout verification

Techniques are disclosed for optimizing the pattern density in the circuit layout design of a circuit layer. A layer in circuit design is analyzed to define empty regions that can be filled with fill polygons (referred to hereafter as 'fill' regions). Next, a pattern of fill polygons is generated. After the fill polygons have been defined, the layout design for the layer is divided into separate areas or 'windows,' and a target density for each window is determined. Once this target density for the window has been determined, the fill polygons required to most closely approach this target density are generated and added to the circuit layout design. This process may be repeated with progressively different (e.g., smaller) fill polygons, until each window meets or exceeds both the specified minimum density and complies with the specified maximum density gradient. Additionally, some implementations may allow a user to simultaneously optimize the density of multiple layers of a circuit by adding fill polygons to multiple layers of a circuit design simultaneously. Representations of sections of a multilayer fill structure will then be added to corresponding layers the circuit design until a specified target density is met.

Simultaneous multi-layer fill generation

Layout design data is seeded with sampling markers. The sampling markers are used to determine patterning scores for patterning clusters in the layout design data, such that a patterning score corresponds to a particular coloring arrangement, and the value of a patterning score corresponds to how many of the sampling markers have a given color. Coloring arrangements are then applied to the patterning clusters based upon the patterning scores.

Preserving hierarchy and coloring uniformity in multi-patterning layout design

Techniques for efficiently determining whether an interconnect line has an impedance component value below a maximum specified value. A specified maximum impedance component value is used to limit the number of interconnect lines that are analyzed by a parasitic extraction analysis process. An analysis window is created based upon the characteristics of the interconnect lines and the specified maximum impedance component value. The size of the window corresponds to the minimum length of the interconnect line that would have the specified maximum impedance component value. Once the analysis window has been created, the interconnect lines are examined to determine if any of them reaches to or beyond the analysis window, whereby interconnect lines that exceed the specified maximum impedance component value can be identified. If there are any remaining interconnect lines that have not been determined to exceed the specified maximum impedance component value through the use of the analysis window, then the impedance component values of these remaining interconnect lines can be specifically determined using a parasitic extraction process.

Electrostatic damage protection circuitry verification

This application discloses a computing system implementing one or more tools or mechanism configured to capture a hierarchy of a circuit design layout generated by a downstream tool. The hierarchy can include multiple cells that identify corresponding portions of the circuit design layout. The tools or mechanism can be further configured to modify the circuit design layout based, at least in part, on the captured hierarchy, which alters the portions of the circuit design layout identified by the cells separately from other portions of the circuit design layout.

Hierarchical fill in a design layout

This application discloses a computing system implementing tools and mechanisms that can incorporate an optical physical uncloneable function (PUF) device in a circuit design. The optical physical uncloneable function device can generate at least a portion of a key. The tools and mechanisms can interconnect the optical physical uncloneable function device with a security control device in the circuit design, wherein the security control device is configured to initiate a security action when the key matches an expected key in the security controller.

Optical physical uncloneable function

Aspects of the disclosed technology relate to techniques of combining directed self-assembly lithography and multiple patterning lithography. A coloring/grouping graph is first generated from layout data of a layout design. In the coloring/grouping graph, each coloring edge connects two nodes representing layout features that must be assigned to different masks, and each grouping/coloring edge connects two nodes representing layout features that should either be grouped together for DSA (directed-self-assembly) lithography or be assigned to different masks for multiple patterning lithography. The node groups formed by nodes connected with the coloring edges are colored. Colors of the nodes in one or more of node groups connected by the grouping/coloring edges are adjusted to convert one or more of the grouping/coloring edges into the coloring edges. After conversion, layout features represented by the nodes directly connected with the grouping/coloring edges are grouped together for generating guiding patterns.

Growing community of inventors

Beaverton, OR, United States of America

Fedor G Pikus