Macau University of Science and Technology

Fajun Yang

Mengchu Zhou

Naiqi Wu

Yan Qiao

Zhiwu Li

Liping Bai

A system and method of controlling a cluster tool apparatus, wherein the cluster tool includes one or more processing modules and a robot that is configured to move a semiconductor product to and from the one or more processing modules, the cluster tool configured for processing semiconductor products. The method of controlling the cluster tool apparatus to perform a processing cycle includes receiving a plurality of system parameters from a user interface, wherein the system parameters relate to one or more processing steps of the processing cycle, determining a schedule for performing the processing cycle utilizing the one or more processing modules, wherein the schedule being determined based on a semiconductor product residency parameter.

Cluster tool apparatus and a method of controlling a cluster tool apparatus

A system and method of controlling a multi cluster tool system configured to process a semiconductor product includes a plurality of cluster tools arranged adjacent each other, a buffer module positioned between a pair of cluster tools, each cluster tool including a plurality of processing modules and a robot, the method of controlling a multi cluster tool system including receiving a plurality of system parameters from a user interface, wherein the system parameters correspond to one or more processing steps in a system cycle, wherein the system cycle is a cycle of processing the semiconductor product, determining a system schedule for defining the system cycle for processing a semiconductor product, the system schedule providing robot waiting times for each robot of each cluster tool, controlling, via a controller, the operation of each robot of each cluster tool based on the determined schedule.

Multi cluster tool system and a method of controlling a multi tool cluster system

A method determines an optimized production schedule of a production line including a hybrid multi-cluster tool formed by a plurality of single-arm tools and dual-arm tools interconnected with each other. The method includes determining time for individual operations of a robotic arm and a processing module in the plurality of single-arm tools and dual-arm tools; determining robot waiting time of the single-arm tools and dual-arm tools based on the time for individual operations and different connection relationships of the plurality of single-arm tools and dual-arm tools; determining whether the optimized production schedule exists using the determined waiting time, wherein the optimized production schedule only exists if the hybrid multi-cluster tool is process-dominant where the robot activity time of the plurality of single-arm tools and dual-arm tools is substantially shorter than processing time at the processing module; and determining the optimized production schedule if the optimized production schedule exists.

System and method for determining an optimized schedule of a production line

Since single and dual-arm tools behave differently, it is difficult to coordinate their activities in a hybrid multi-cluster tool that is composed of both single- and dual-arm tools. Aiming at finding an optimal one-wafer cyclic schedule for a treelike hybrid multi-cluster tool whose bottleneck tool is process-bound, the present work extends a resource-oriented Petri net to model such system. By the developed Petri net model, to find a one-wafer cyclic schedule is to determine robot waiting times. By doing so, it is shown that, for any treelike hybrid multi-cluster tool whose bottleneck tool is process-bound, there is always a one-wafer cyclic schedule. Then, computationally efficient algorithms are developed to obtain the minimal cycle time and the optimal one-wafer cyclic schedule. Examples are given to illustrate the developed method.

Petri net-based optimal one-wafer cyclic scheduling of treelike hybrid multi-cluster tools

In semiconductor manufacturing, there are wafer fabrication processes in cluster tools that need a wafer to visit some processing steps for more than once, leading to a revisiting process. Also, wafers may be subject to wafer residency time constraints. By considering atomic layer deposition (ALD) as a typical wafer revisiting process, this invention studies the challenging scheduling problem of single-arm cluster tools for the ALD process with wafer residency time constraints. By recognizing that the key to this problem is to schedule the robot tasks, the present invention presents different robot task sequencing strategies. With these strategies for different cases, the present invention performs the schedulability analysis and derives the schedulability conditions for such tools for the first time. If schedulable, the present invention proposes scheduling algorithms to obtain an optimal schedule efficiently. Illustrative examples are given to show the application of the proposed concepts and approach.

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Fajun Yang