International Business Machines Corporation

Hitachi Global Storage Technologies Netherlands B.v.

Eun K Row

Cherngye Hwang

Dennis R McKean

Ning Shi

Jennifer Lu

Qing Dai

Li Fei Zheng

Brad Jackson

Ping-Wei Chang

Michael L Workman

Bulent Nihat Kurdi

Michael R Hatchett

Detlef Gador

John S Heath

Hubert C Lee

Eric (Yongjian) Sun

Roger D Spencer

A method of physical vapor deposition (PVD) is disclosed in which xenon is used as the operating gas in the vacuum chamber in the deposition of an adhesion layer, preferably silicon, which allows the adhesion layer to be ultra-thin with improved durability over prior art films. The use of argon as is typical in the prior art results in argon atoms being incorporated into the ultra-thin silicon film with deleterious results. In films that are only several angstroms thick, the contamination of the film with argon or other elements can yield a film with reduced adhesion performance and in some cases noble atoms such as argon can escape the film leaving voids or pinholes. The use of the larger and heavier xenon atoms in the vacuum chamber produces a substantially purer film with reduced risk of voids and pinholes. In a preferred embodiment the use of xenon as the operating gas for deposition of the silicon adhesion layer is combined with the use of a filtered cathodic arc (FCA) process to deposit the protective overcoat, preferably carbon based, on a magnetic recording head.

Method for depositing a thin film adhesion layer

A method is provided for planarization of structures which minimizes step heights, reduces process steps, improves cleanliness, and provides increased ease of debond. Structures are placed with working surfaces facing down onto an adhesive layer such that structures remain fixed during heating. A bi-layer encapsulating film is used to achieve planarization. A carrier is bi-laminated with a thermoplastic film layer followed by a chemically inert protective polymer film layer that can withstand etch and cleaning processes. The thermoplastic layer is laminated on top of the carrier; the polymer layer is laminated on top of the joined thermoplastic layer and carrier. The carrier with bi-layer film is then placed onto the backside of the structures to resist chemical attack from the front side during photostrip and enable planarization. When heat is applied, the bi-layer encapsulating film melts and pushes the polymer layer into the gaps between structures thereby achieving complete planarization.

Planarization method for a structure having a first surface for etching and a second surface

A process to reduce step heights in planarization of thin film carriers in an encapsulation system. The improvements include using an adhesive tape having a thinner adhesive thickness and a stiffer tape for the film sealing the encapsulant on the carrier to result in a low step height surface transition between the carrier and the cured encapsulant. The composition of the encapsulant is modified to reduce the shrinkage upon curing of the encapsulant. The encapsulant may include an absorbent that absorbs the irradiation and cause the top surface to harden first compared to the bulk of the encapsulant, and/or a gas-emitting additive that creates gaseous products that expand upon irradiation to thereby reduce the shrinkage of the encapsulant upon curing. Alternatively, irradiation at very low incidence angle relative to the top surface of the encapsulant causes the top surface to harden before the bulk of the encapsulant.

Planarization in an encapsulation process for thin film surfaces

Planarization process for thin film surfaces

A method for fabricating a transducer with landing pads without edge fences is described. Preferably an adhesion layer and then the pad layer are deposited in voids in a photoresist. The thickness of the masking layer on the surface of the pad layer should be sufficient to protect pad layer during the subsequent ashing step, but the thickness of the masking material at the sidewalls on the pad layer fences should be thin enough so that the fences are not protected during ashing. After stripping the photoresist material, the structure is ashed preferably by an oxygen-containing plasma. The ashing process, with assistance from mechanical abrasion, removes the fence structures on the pad layer, since the thinner masking layer at the sidewalls provides less protection to the fence structures than is provided to the bulk of the pad layer where the masking layer is thicker.

Method of fabricating slider pads for a transducer operating with moving magnetic media

A method is provided for grading the surface topography of a surface to improve step coverage for an overcoat. In accordance with one aspect of the present invention, an ABS of a slider and sensitive element of a magnetic head is graded to provide better step coverage of an overcoat of ultra-thin DLC film. After lapping the ABS, a thin film is deposited on the lapped surface to cover any scratches, irregularities, and steps. The thin film is sputter etched at a glancing angle to grade the topography of the slider ABS. Sputtering at a glancing angle removes the thin film in planar regions faster than the thin film under the shadow of the glancing angle, which is near surface irregularities. The graded surface is then covered by a DLC deposition.

Method for grading surface topography for improved step coverage and planarization

A multiple disk drive system having two disk-head assemblies (HDA) internally mounted on a rigid frame and accessible via a common industry-standard interface connector is provided. Each HDA is enclosed in a separate housing which is mounted on the disk drive system frame. A vibration damper mounted on the disk drive system frame physically contacts each HDA housing providing a spring force which minimizes the effects of shock and vibration on the operation of the HDAs. The vibration damper is coated with a low-wear, electrically insulating material to provide electrical isolation between the vibration damper and the HDAs housings. The coating material is chosen to also provide a desired coefficient of friction between the vibration damper and the HDA housings. A single electronic controller board is shared by both HDAs and is mounted on the bottom side of the frame underlying the HDAs. The controller board may implement SCSI or IPI interfaces in either differential or single-ended versions. The assembly is fully enclosed with metal top and bottom covers to provide separate enclosures for the HDAs, controller board cooling and EMC and RFI protection.

Vibration damper for a multiple disk drive unit

Growing community of inventors

San Jose, CA, United States of America

Eun K Row